Discrete Semiconductor Products

PMEG4020EPAS-QX

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40 V, 2 A LOW VF SCHOTTKY BARRIER RECTIFIER

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Search across all available documentation for this part.

DocumentsEvaluation of junction temperature and thermal stacks using the virtual junction PMEG4020EPAS-Q Nexperia Product Reliability +11

Discrete Semiconductor Products

PMEG4020EPAS-QX

Active

Nexperia USA Inc.

40 V, 2 A LOW VF SCHOTTKY BARRIER RECTIFIER

Deep-Dive with AI

DocumentsEvaluation of junction temperature and thermal stacks using the virtual junction PMEG4020EPAS-Q Nexperia Product Reliability +11

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	PMEG4020EPAS-QX

Capacitance @ Vr, F	270 pF
Current - Average Rectified (Io)	2 A
Current - Reverse Leakage @ Vr	100 µA
Grade	Automotive
Mounting Type	Surface Mount
Operating Temperature - Junction	150 ¯C
Package / Case	3-UDFN Exposed Pad
Qualification	AEC-Q101
Reverse Recovery Time (trr)	6 ns
Speed	500 ns, 200 mA
Supplier Device Package	DFN2020D-3
Technology	Schottky
Voltage - DC Reverse (Vr) (Max) [Max]	40 V
Voltage - Forward (Vf) (Max) @ If [Max]	535 mV

PMEG4020EPAS-Q Series

40 V, 2 A low VF Schottky barrier rectifier

Part	Voltage - Forward (Vf) (Max) @ If [Max]	Capacitance @ Vr, F	Reverse Recovery Time (trr)	Qualification	Speed	Mounting Type	Technology	Voltage - DC Reverse (Vr) (Max) [Max]	Operating Temperature - Junction	Current - Reverse Leakage @ Vr	Grade	Current - Average Rectified (Io)	Package / Case	Supplier Device Package
Nexperia USA Inc. PMEG4020EPAS-QX	535 mV	270 pF	6 ns	AEC-Q101	200 mA 500 ns	Surface Mount	Schottky	40 V	150 ¯C	100 µA	Automotive	2 A	3-UDFN Exposed Pad	DFN2020D-3

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.20

Description

General part information

PMEG4020EPAS-Q Series

Planar Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.