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UMT1NTN
Discrete Semiconductor Products

UMT1NTN

Active
Rohm Semiconductor

PNP+PNP, SOT-363, GENERAL PURPOSE AMPLIFICATION TRANSISTOR

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UMT1NTN
Discrete Semiconductor Products

UMT1NTN

Active
Rohm Semiconductor

PNP+PNP, SOT-363, GENERAL PURPOSE AMPLIFICATION TRANSISTOR

Technical Specifications

Parameters and characteristics for this part

SpecificationUMT1NTN
Current - Collector (Ic) (Max) [Max]150 mA
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]120
Frequency - Transition140 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-363, SC-88, 6-TSSOP
Supplier Device PackageUMT6
Transistor Type2 PNP (Dual)
Vce Saturation (Max) @ Ib, Ic500 mV
Voltage - Collector Emitter Breakdown (Max) [Max]50 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 5166$ 0.42

Description

General part information

UMT1N Series

Devices integrating two transistors are available in ultra-compact packages, suitable for various applications such as pre-amplifier differential amplification circuits, high-frequency oscillators, driver ICs and so forth.

Documents

Technical documentation and resources

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

ESD Data

Characteristics Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Taping Information

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Reliability Test Result

Manufacturing Data

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Inner Structure

Package Information

Types and Features of Transistors

Application Note

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

UMT1N Data Sheet

Data Sheet

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Moisture Sensitivity Level - Transistors

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Explanation for Marking

Package Information

How to Create Symbols for PSpice Models

Models

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Package Dimensions

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

About Flammability of Materials

Environmental Data

What Is Thermal Design

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

About Export Regulations

Export Information

Part Explanation

Application Note

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design