Connectors, Interconnects

614-83-069-11-061112

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Preci-Dip

CONN SOCKET PGA 69POS GOLD

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Connectors, Interconnects

614-83-069-11-061112

Active

Preci-Dip

CONN SOCKET PGA 69POS GOLD

Deep-Dive with AI

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	614-83-069-11-061112

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating [custom]	29.5 µin
Contact Finish Thickness - Mating [custom]	0.75 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Contact Resistance	10 mOhm
Current Rating (Amps)	1 A
Features	Open Frame, Carrier
Housing Material	Polyester, Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	69
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.136 in
Termination Post Length	3.45 mm
Type	PGA

614-83 Series

Part	Material Flammability Rating	Contact Resistance	Current Rating (Amps)	Termination Post Length	Termination Post Length	Contact Finish - Mating	Type	Type	Type	Contact Finish Thickness - Mating [custom]	Contact Finish Thickness - Mating [custom]	Features	Contact Material - Mating	Termination	Housing Material	Pitch - Post	Pitch - Post	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Post [custom]	Mounting Type	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Type [custom]	Type [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Preci-Dip 614-83-950-41-001101	UL94 V-0	10 mOhm	1 A	0.136 in	3.45 mm	Gold	DIP	22.86 mm	0.9 in	29.5 µin	0.75 µm	Carrier Open Frame	Beryllium Copper	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	-55 C	125 °C	Brass	Through Hole	Tin	0.1 "	2.54 mm	2	50	25
Preci-Dip 614-83-428-31-012101	UL94 V-0	10 mOhm	1 A	0.136 in	3.45 mm	Gold	DIP		0.4 in	29.5 µin	0.75 µm	Carrier Open Frame	Beryllium Copper	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	-55 C	125 °C	Brass	Through Hole	Tin	0.1 "	2.54 mm				28
Preci-Dip 614-83-044-08-031112	UL94 V-0	10 mOhm	1 A	0.136 in	3.45 mm	Gold	PGA			29.5 µin	0.75 µm	Carrier Open Frame	Beryllium Copper	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	-55 C	125 °C	Brass	Through Hole	Tin	0.1 "	2.54 mm	8		8	44
Preci-Dip 614-83-069-11-061112	UL94 V-0	10 mOhm	1 A	0.136 in	3.45 mm	Gold	PGA			29.5 µin	0.75 µm	Carrier Open Frame	Beryllium Copper	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	-55 C	125 °C	Brass	Through Hole	Tin	0.1 "	2.54 mm				69
Preci-Dip 614-83-068-10-061112	UL94 V-0	10 mOhm	1 A	0.136 in	3.45 mm	Gold	PGA			29.5 µin	0.75 µm	Carrier Open Frame	Beryllium Copper	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	-55 C	125 °C	Brass	Through Hole	Tin	0.1 "	2.54 mm	10		10	68
Preci-Dip 614-83-636-31-012101	UL94 V-0	10 mOhm	1 A	0.136 in	3.45 mm	Gold	DIP			29.5 µin	0.75 µm	Carrier Open Frame	Beryllium Copper	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	-55 C	125 °C	Brass	Through Hole	Tin	0.1 "	2.54 mm				36	15.24 mm	0.6 in
Preci-Dip 614-83-304-41-001101	UL94 V-0	10 mOhm	1 A	0.136 in	3.45 mm	Gold	DIP	7.62 mm	0.3 in	29.5 µin	0.75 µm	Carrier Open Frame	Beryllium Copper	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	-55 C	125 °C	Brass	Through Hole	Tin	0.1 "	2.54 mm				4 pins			2 x 2
Preci-Dip 614-83-952-31-012101	UL94 V-0	10 mOhm	1 A	0.136 in	3.45 mm	Gold	DIP	22.86 mm	0.9 in	29.5 µin	0.75 µm	Carrier Open Frame	Beryllium Copper	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	-55 C	125 °C	Brass	Through Hole	Tin	0.1 "	2.54 mm
Preci-Dip 614-83-179-18-112112	UL94 V-0	10 mOhm	1 A	0.136 in	3.45 mm	Gold	PGA			29.5 µin	0.75 µm	Carrier Open Frame	Beryllium Copper	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	-55 C	125 °C	Brass	Through Hole	Tin	0.1 "	2.54 mm				179				18	18
Preci-Dip 614-83-084-10-001112	UL94 V-0	10 mOhm	1 A	0.136 in	3.45 mm	Gold	PGA			29.5 µin	0.75 µm	Carrier Open Frame	Beryllium Copper	Solder	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	-55 C	125 °C	Brass	Through Hole	Tin	0.1 "	2.54 mm				84

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	684	$ 10.76
	N/A	0	$ 10.59

Description

General part information

614-83 Series

69 (11 x 11) Pos PGA Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available