Zenode.ai Logo
Beta
RF601BM2DTL
Discrete Semiconductor Products

RF601BM2DTL

Obsolete
Rohm Semiconductor

FAST / ULTRAFAST DIODE, 200 V, 6 A, DUAL COMMON CATHODE, 930 MV, 25 NS, 60 A

Deep-Dive with AI

Search across all available documentation for this part.

RF601BM2DTL
Discrete Semiconductor Products

RF601BM2DTL

Obsolete
Rohm Semiconductor

FAST / ULTRAFAST DIODE, 200 V, 6 A, DUAL COMMON CATHODE, 930 MV, 25 NS, 60 A

Technical Specifications

Parameters and characteristics for this part

SpecificationRF601BM2DTL
Current - Average Rectified (Io) (per Diode)6 A
Current - Reverse Leakage @ Vr10 ÁA
Diode Configuration1 Pair Common Cathode
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Reverse Recovery Time (trr)25 ns
Speed500 ns, 200 mA
Supplier Device PackageTO-252
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]200 V
Voltage - Forward (Vf) (Max) @ If930 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 5$ 1.32

Description

General part information

RF601BM2D Series

RF601BM2D is the silicon epitaxial planar type Fast Recovery Diode.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Explanation for Marking

Package Information

Part Explanation

Application Note

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Power Loss and Thermal Design of Diodes

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Inner Structure

Package Information

Compliance of the RoHS directive

Environmental Data

How to Use LTspice® Models

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

About Export Regulations

Export Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Diode Types and Applications

Technical Article

Reliability Test Result

Manufacturing Data

Condition of Soldering / Land Pattern Reference

Package Information

Moisture Sensitivity Level - Diodes

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Package Dimensions

Package Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Create Symbols for PSpice Models

Models

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Taping Information

Package Information

ESD Data

Characteristics Data

PCB Layout Thermal Design Guide

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Anti-Whisker formation - Diodes

Package Information

What is a Thermal Model? (Diode)

Thermal Design

About Flammability of Materials

Environmental Data

How to Select Rectifier Diodes

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

What Is Thermal Design

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification