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Technical Specifications
Parameters and characteristics for this part
| Specification | TMMH-106-01-L-DV-A-M |
|---|---|
| Connector Type | Cuttable, Header |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 10 çin |
| Contact Finish Thickness - Mating | 0.25 çm |
| Contact Length - Mating | 3.2 mm |
| Contact Length - Mating | 0.126 " |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Male Pin |
| Fastening Type | Push-Pull |
| Features | Pick and Place, Board Guide |
| Insulation Color | Black |
| Insulation Height | 0.079 in |
| Insulation Height | 2 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Surface Mount |
| Number of Positions | 12 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating [x] | 0.079 in |
| Pitch - Mating [x] | 2 mm |
| Row Spacing - Mating | 0.079 in |
| Row Spacing - Mating | 2 mm |
| Shrouding | Unshrouded |
| Style | Board to Board, Cable |
| Termination | Solder |
| Part | Contact Finish - Post | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions Loaded | Contact Material | Contact Finish - Mating | Insulation Height | Insulation Height | Insulation Color | Features | Contact Shape | Number of Rows | Contact Type | Number of Positions | Row Spacing - Mating | Row Spacing - Mating | Style | Contact Length - Mating [x] | Contact Length - Mating [x] | Mounting Type | Fastening Type | Connector Type | Insulation Material | Operating Temperature [Min] | Operating Temperature [Max] | Shrouding | Material Flammability Rating | Pitch - Mating [x] | Pitch - Mating [x] | Contact Length - Mating | Contact Length - Mating | Contact Length - Post | Contact Length - Post | Overall Contact Length | Overall Contact Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Tin | Solder | 30 Áin | 0.76 Ám | All | Phosphor Bronze | Gold | 0.079 in | 2 mm | Black | Board Guide | Square | 2 | Male Pin | 12 | 0.079 in | 2 mm | Board to Board Cable | 1.9 mm | 0.075 in | Surface Mount | Push-Pull | Cuttable Header | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Unshrouded | UL94 V-0 | 0.079 in | 2 mm | ||||||
Samtec Inc. | Tin | Solder | 3 µin | 0.076 µm | All | Phosphor Bronze | Gold | 0.079 in | 2 mm | Black | Square | 2 | Male Pin | 12 | 0.079 in | 2 mm | Board to Board Cable | Surface Mount | Push-Pull | Cuttable Header | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Unshrouded | UL94 V-0 | 0.079 in | 2 mm | 0.065 in | 1.65 mm | |||||||
Samtec Inc. | Tin | Solder | 3 µin | 0.076 µm | All | Phosphor Bronze | Gold | 0.079 in | 2 mm | Black | Board Guide Pick and Place | Square | 2 | Male Pin | 12 | 0.079 in | 2 mm | Board to Board Cable | 1.9 mm | 0.075 in | Surface Mount | Push-Pull | Cuttable Header | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Unshrouded | UL94 V-0 | 0.079 in | 2 mm | ||||||
Samtec Inc. | Tin | Solder | 10 çin | 0.25 çm | All | Phosphor Bronze | Gold | 0.079 in | 2 mm | Black | Board Guide Pick and Place | Square | 2 | Male Pin | 12 | 0.079 in | 2 mm | Board to Board Cable | Surface Mount | Push-Pull | Cuttable Header | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Unshrouded | UL94 V-0 | 0.079 in | 2 mm | 0.126 " | 3.2 mm | ||||||
Samtec Inc. | Tin | Solder | 10 çin | 0.25 çm | All | Phosphor Bronze | Gold | 0.079 in | 2 mm | Black | Board Guide Pick and Place | Square | 2 | Male Pin | 12 | 0.079 in | 2 mm | Board to Board Cable | Surface Mount | Push-Pull | Cuttable Header | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Unshrouded | UL94 V-0 | 0.079 in | 2 mm | 0.126 " | 3.2 mm | ||||||
Samtec Inc. | Tin | Solder | 30 Áin | 0.76 Ám | All | Phosphor Bronze | Gold | 0.079 in | 2 mm | Black | Square | 2 | Male Pin | 12 | 0.079 in | 2 mm | Board to Board Cable | Through Hole | Push-Pull | Cuttable Header | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Unshrouded | UL94 V-0 | 0.079 in | 2 mm | 0.126 " | 3.2 mm | 0.139 in | 3.53 mm | 8.74 mm | 0.344 in | |||
Samtec Inc. | Tin | Solder | 3 µin | 0.076 µm | All | Phosphor Bronze | Gold | 0.079 in | 2 mm | Black | Pick and Place | Square | 2 | Male Pin | 12 | 0.079 in | 2 mm | Board to Board Cable | Surface Mount | Push-Pull | Cuttable Header | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Unshrouded | UL94 V-0 | 0.079 in | 2 mm | 0.065 in | 1.65 mm | ||||||
Samtec Inc. | Tin | Solder | 3 µin | 0.076 µm | All | Phosphor Bronze | Gold | 0.079 in | 2 mm | Black | Square | Male Pin | 24 | 0.079 in | 2 mm | Board to Board Cable | Through Hole | Push-Pull | Cuttable Header | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Unshrouded | UL94 V-0 | 0.079 in | 2 mm | 0.126 " | 3.2 mm | 0.097 in | 2.47 mm | 7.67 mm | 0.302 in | ||||
Samtec Inc. | Tin | Solder | 3 µin | 0.076 µm | All | Phosphor Bronze | Gold | 0.079 in | 2 mm | Black | Square | 2 | Male Pin | 12 | 0.079 in | 2 mm | Board to Board Cable | Through Hole | Push-Pull | Cuttable Header | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Unshrouded | UL94 V-0 | 0.079 in | 2 mm | 0.126 " | 3.2 mm | 0.139 in | 3.53 mm | 8.74 mm | 0.344 in | |||
Samtec Inc. | Tin | Solder | 30 Áin | 0.76 Ám | All | Phosphor Bronze | Gold | 0.079 in | 2 mm | Black | Square | 3 | Male Pin | 18 | 0.079 in | 2 mm | Board to Board Cable | Through Hole | Push-Pull | Cuttable Header | Liquid Crystal Polymer (LCP) | -55 °C | 125 °C | Unshrouded | UL94 V-0 | 0.079 in | 2 mm | 0.126 " | 3.2 mm | 0.097 in | 2.47 mm | 7.67 mm | 0.302 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tube | 1 | $ 2.87 | |
Description
General part information
TMMH-106 Series
Connector Header Surface Mount 12 position 0.079" (2.00mm)
Documents
Technical documentation and resources
No documents available