Integrated Circuits (ICs)

SOMDM3730-11-2783IFCR-A

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SYSTEM ON MODULE LV DM3730

Integrated Circuits (ICs)

Active

SYSTEM ON MODULE LV DM3730

Technical Specifications

Parameters and characteristics for this part

Part	Module/Board Type	Speed	Co-Processor	Operating Temperature (Max)	Operating Temperature (Min)	Core Processor	Connector Type	Connector Pin Count	RAM Size	Size / Dimension Width	Size / Dimension Length	Flash Size	Flash Type	Flash Size (NOR)	Flash Size (NAND)
Beacon EmbeddedWorks SOMDM3730-11-2783IFCR-A	DSP Core MPU	1 GHz	TMS320C64x (DSP)	70 °C	0 °C	ARM® Cortex®-A8 DM3730	Board-to-Board (BTB) Socket	200	256 MB	3.01 in	1.23 in	512 MB
Beacon EmbeddedWorks SOMDM3730-20-1780AGIR	DSP Core MPU	800 MHz	TMS320C64x (DSP)	85 °C	-40 °C	ARM® Cortex®-A8 DM3730	Board-to-Board (BTB) Socket	200	256 MB	1.06 in	0.59 in	512 MB
Beacon EmbeddedWorks SOMDM3730-20-2780AGCR	DSP Core MPU	1 GHz	TMS320C64x (DSP)	70 °C	0 °C	ARM® Cortex®-A8 DM3730	Board-to-Board (BTB) Socket	200	256 MB	1.06 in	0.59 in	512 MB
Beacon EmbeddedWorks SOMDM3730-11-1783JFIR	MPU Core	800 MHz		85 °C	-40 °C	DM3730			256 MB	1.22 in	3 in		NAND NOR	16 MB	512 MB
Beacon EmbeddedWorks SOMDM3730-32-2780AKCR	DSP Core MPU	1 GHz	TMS320C64x (DSP)	70 °C	0 °C	ARM® Cortex®-A8 DM3730	Board-to-Board (BTB) Socket	200	256 MB	1.3 in	0.59 in	512 MB

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

3D models and CAD resources for this part

General part information

DM37x Embedded Module ARM® Cortex®-A8, DM3730 TMS320C64x (DSP) 1GHz 256MB 512MB

Technical documentation and resources