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RQ1E100XNTR
Discrete Semiconductor Products

RQ1E100XNTR

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Rohm Semiconductor

NCH 30V 10A SMALL SIGNAL MOSFET

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RQ1E100XNTR
Discrete Semiconductor Products

RQ1E100XNTR

Active
Rohm Semiconductor

NCH 30V 10A SMALL SIGNAL MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRQ1E100XNTR
Current - Continuous Drain (Id) @ 25°C10 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs12.7 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]1000 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Power Dissipation (Max) [Max]550 mW
Rds On (Max) @ Id, Vgs10.5 mOhm
Supplier Device PackageTSMT8
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 0.43

Description

General part information

RQ1E100XN Series

MOSFETs are made as ultra-low ON-resistance by the micro-processing technologies suitable for mobile equipment for low current consumption. In wide lineup including compact type, high-power type and complex type to meet in the market.

Documents

Technical documentation and resources

Method for Monitoring Switching Waveform

Schematic Design & Verification

Explanation for Marking

Package Information

RQ1E100XN Data Sheet

Data Sheet

Taping Information

Package Information

Inner Structure

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

How to Create Symbols for PSpice Models

Models

What Is Thermal Design

Thermal Design

Part Explanation

Application Note

Two-Resistor Model for Thermal Simulation

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Package Dimensions

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Reliability Test Result

Manufacturing Data

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

List of Transistor Package Thermal Resistance

Thermal Design

About Flammability of Materials

Environmental Data

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Compliance of the RoHS directive

Environmental Data

Types and Features of Transistors

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

ESD Data

Characteristics Data

How to Use LTspice® Models

Schematic Design & Verification

About Export Regulations

Export Information

Moisture Sensitivity Level - Transistors

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article