Integrated Circuits (ICs)

R7F7017103ABG-C#HC1

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32BIT MCU RH850/F1KH-D8

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Integrated Circuits (ICs)

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32BIT MCU RH850/F1KH-D8

Technical Specifications

Parameters and characteristics for this part

Specification	R7F7017103ABG-C#HC1

Connectivity	I2C, Ethernet, CANbus, LINbus, CSI, UART/USART
Core Processor	RH850G3KH
Core Size	32 Bit
Core Size	Dual-Core
Data Converters	32x12b, A/D 38x10b
EEPROM Size	256 K
Mounting Type	Surface Mount
Number of I/O	174
Operating Temperature [Max]	105 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	233-FBGA
Peripherals	PWM, DMA, WDT
Program Memory Size	6 MB
Program Memory Type	FLASH
RAM Size	896 K
Speed	240 MHz
Supplier Device Package	233-FBGA
Supplier Device Package [x]	15
Supplier Device Package [y]	15
Voltage - Supply (Vcc/Vdd) [Max]	5.5 V
Voltage - Supply (Vcc/Vdd) [Min]	3 V

Part	Core Processor	Operating Temperature [Min]	Operating Temperature [Max]	Data Converters	Oscillator Type	Speed	RAM Size	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]	Supplier Device Package	Supplier Device Package [x]	Supplier Device Package [y]	Program Memory Type	Connectivity	Mounting Type	Package / Case	Core Size	Core Size	Program Memory Size	EEPROM Size	Number of I/O	Peripherals
Renesas Electronics Corporation R7F7017103ABG-C#HC1	RH850G3KH	-40 °C	105 °C	32x12b A/D 38x10b	Internal	240 MHz	896 K	5.5 V	3 V	233-FBGA	15	15	FLASH	CANbus CSI Ethernet I2C LINbus UART/USART	Surface Mount	233-FBGA	32 Bit	Dual-Core	6 MB	256 K	174	DMA PWM WDT

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

RH850G3KH RH850/F1KM-D8 Microcontroller IC 32-Bit Dual-Core 240MHz 6MB (6M x 8) FLASH 233-FBGA (15x15)

Technical documentation and resources