Integrated Circuits (ICs)

R7F7017103ABG-C#HC1

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32BIT MCU RH850/F1KH-D8

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Integrated Circuits (ICs)

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32BIT MCU RH850/F1KH-D8

Technical Specifications

Parameters and characteristics for this part

Specification	R7F7017103ABG-C#HC1

Connectivity	I2C, UART/USART, CSI, CANbus, Ethernet, LINbus
Core Processor	RH850G3KH
Core Size [custom]	32-Bit Dual-Core
Data Converters	32x12b, 38x10b
EEPROM Size	256 K
Mounting Type	Surface Mount
Number of I/O	174
Operating Temperature [Max]	105 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	233-FBGA
Peripherals	WDT, PWM, DMA
Program Memory Size	6 MB
Program Memory Type	FLASH
RAM Size	896 K
Speed	240 MHz
Supplier Device Package	233-FBGA (15x15)
Voltage - Supply (Vcc/Vdd) [Max]	5.5 V
Voltage - Supply (Vcc/Vdd) [Min]	3 V

Part	Program Memory Type	Program Memory Size	Data Converters	Core Processor	Speed	Connectivity	Oscillator Type	EEPROM Size	Number of I/O	Peripherals	RAM Size	Supplier Device Package	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Package / Case	Core Size [custom]	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]
Renesas Electronics Corporation R7F7017103ABG-C#HC1	FLASH	6 MB	32x12b 38x10b	RH850G3KH	240 MHz	CANbus CSI Ethernet I2C LINbus UART/USART	Internal	256 K	174	DMA PWM WDT	896 K	233-FBGA (15x15)	105 °C	-40 °C	Surface Mount	233-FBGA	32-Bit Dual-Core	5.5 V	3 V

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	1000	$ 21.07

General part information

RH850G3KH RH850/F1KM-D8 Microcontroller IC 32-Bit Dual-Core 240MHz 6MB (6M x 8) FLASH 233-FBGA (15x15)

Technical documentation and resources