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Technical Specifications
Parameters and characteristics for this part
| Specification | ESQT-116-02-F-D-760 |
|---|---|
| Connector Type | Elevated Socket |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 3 µin |
| Contact Finish Thickness - Mating | 0.076 µm |
| Contact Length - Post | 0.09 " |
| Contact Length - Post | 2.29 mm |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Forked |
| Current Rating (Amps) | 4.5 A |
| Fastening Type | Push-Pull |
| Insulation Color | Black |
| Insulation Height | 0.76 in |
| Insulation Height | 19.3 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating [x] | 0.079 in |
| Pitch - Mating [x] | 2 mm |
| Row Spacing - Mating | 0.079 in |
| Row Spacing - Mating | 2 mm |
| Style | Board to Board, Cable |
| Termination | Solder |
| Part | Contact Type | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Contact Length - Post | Contact Length - Post | Termination | Insulation Height | Insulation Height | Style | Contact Finish - Post | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating [x] | Pitch - Mating [x] | Row Spacing - Mating | Row Spacing - Mating | Connector Type | Contact Finish - Mating | Contact Material | Number of Positions Loaded | Material Flammability Rating | Insulation Color | Fastening Type | Number of Rows | Contact Shape | Insulation Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Length - Post [x] | Contact Length - Post [x] | Number of Positions | Number of Positions Loaded | Number of Positions |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Forked | -55 °C | 125 °C | Through Hole | 0.54 in | 13.72 mm | Solder | 0.31 in | 7.87 mm | Board to Board Cable | Tin | 4.5 A | 10 çin | 0.25 çm | 0.079 in | 2 mm | 0.079 in | 2 mm | Elevated Socket | Gold | Phosphor Bronze | All | UL94 V-0 | Black | Push-Pull | 2 | Square | Liquid Crystal Polymer (LCP) | |||||||
Samtec Inc. | Forked | -55 °C | 125 °C | Through Hole | 0.54 in | 13.72 mm | Solder | 0.31 in | 7.87 mm | Board to Board Cable | Gold | 4.5 A | 20 µin | 0.51 µm | 0.079 in | 2 mm | 0.079 in | 2 mm | Elevated Socket | Gold | Phosphor Bronze | All | UL94 V-0 | Black | Push-Pull | 2 | Square | Liquid Crystal Polymer (LCP) | 3 µin | 0.076 µm | |||||
Samtec Inc. | Forked | -55 °C | 125 °C | Through Hole | 0.415 in | 10.54 mm | Solder | 0.435 in | 11.05 mm | Board to Board Cable | Tin | 4.5 A | 10 çin | 0.25 çm | 0.079 in | 2 mm | 0.079 in | 2 mm | Elevated Socket | Gold | Phosphor Bronze | All | UL94 V-0 | Black | Push-Pull | 2 | Square | Liquid Crystal Polymer (LCP) | |||||||
Samtec Inc. | Forked | -55 °C | 125 °C | Through Hole | Solder | 0.53 in | 13.46 mm | Board to Board Cable | Gold | 4.5 A | 20 µin | 0.51 µm | 0.079 in | 2 mm | Elevated Socket | Gold | Phosphor Bronze | All | UL94 V-0 | Black | Push-Pull | 1 | Square | Liquid Crystal Polymer (LCP) | 3 µin | 0.076 µm | 0.32 in | 8.13 mm | 16 | ||||||
Samtec Inc. | Forked | -55 °C | 125 °C | Through Hole | 0.13 in | 3.3 mm | Solder | 0.72 in | 18.3 mm | Board to Board Cable | Gold | 4.5 A | 20 µin | 0.51 µm | 0.079 in | 2 mm | 0.079 in | 2 mm | Elevated Socket | Gold | Phosphor Bronze | All | UL94 V-0 | Black | Push-Pull | 2 | Square | Liquid Crystal Polymer (LCP) | 3 µin | 0.076 µm | |||||
Samtec Inc. | Forked | -55 °C | 125 °C | Through Hole | Solder | 0.79 in | 20.07 mm | Board to Board Cable | Tin | 4.5 A | 10 çin | 0.25 çm | 0.079 in | 2 mm | 0.079 in | 2 mm | Elevated Socket | Gold | Phosphor Bronze | All | UL94 V-0 | Black | Push-Pull | 2 | Square | Liquid Crystal Polymer (LCP) | 0.06 in | 1.52 mm | |||||||
Samtec Inc. | Forked | -55 °C | 125 °C | Through Hole | 0.09 " | 2.29 mm | Solder | 0.76 in | 19.3 mm | Board to Board Cable | Tin | 4.5 A | 3 µin | 0.076 µm | 0.079 in | 2 mm | 0.079 in | 2 mm | Elevated Socket | Gold | Phosphor Bronze | All | UL94 V-0 | Black | Push-Pull | 2 | Square | Liquid Crystal Polymer (LCP) | |||||||
Samtec Inc. | Forked | -55 °C | 125 °C | Through Hole | 0.05 in | 1.27 mm | Solder | 0.408 in | 10.36 mm | Board to Board Cable | Gold | 4.5 A | 20 µin | 0.51 µm | 0.079 in | 2 mm | 0.079 in | 2 mm | Elevated Socket | Gold | Phosphor Bronze | UL94 V-0 | Black | Push-Pull | 2 | Square | Liquid Crystal Polymer (LCP) | 3 µin | 0.076 µm | 31 | |||||
Samtec Inc. | Forked | -55 °C | 125 °C | Through Hole | 0.08 in | 2.03 mm | Solder | 0.77 in | 19.56 mm | Board to Board Cable | Tin | 4.5 A | 10 çin | 0.25 çm | 0.079 in | 2 mm | 0.079 in | 2 mm | Elevated Socket | Gold | Phosphor Bronze | All | UL94 V-0 | Black | Push-Pull | Square | Liquid Crystal Polymer (LCP) | 64 | |||||||
Samtec Inc. | Forked | -55 °C | 125 °C | Through Hole | 0.09 " | 2.29 mm | Solder | 0.368 in | 9.35 mm | Board to Board Cable | Gold | 4.5 A | 20 µin | 0.51 µm | 0.079 in | 2 mm | 0.079 in | 2 mm | Elevated Socket | Gold | Phosphor Bronze | All | UL94 V-0 | Black | Push-Pull | 2 | Square | Liquid Crystal Polymer (LCP) | 3 µin | 0.076 µm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 8.46 | |
Description
General part information
ESQT-116 Series
32 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold
Documents
Technical documentation and resources
No documents available