Integrated Circuits (ICs)

TPA6130A2RTJTG4

Unknown

Texas Instruments

IC AMP CLASS AB STER 290MW 20QFN

Deep-Dive with AI

Search across all available documentation for this part.

Integrated Circuits (ICs)

TPA6130A2RTJTG4

Unknown

Texas Instruments

IC AMP CLASS AB STER 290MW 20QFN

Deep-Dive with AI

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	TPA6130A2RTJTG4

Features	Short-Circuit and Thermal Protection, I2C, Differential Inputs, Shutdown, Depop, Volume Control, Mute
Max Output Power x Channels @ Load [custom]	138 mW, 290 mW
Mounting Type	Surface Mount
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Output Type	Headphones, 2-Channel (Stereo)
Package / Case	20-WFQFN Exposed Pad
Supplier Device Package	20-QFN (4x4)
Type	Class AB
Voltage - Supply [Max]	5.5 V
Voltage - Supply [Min]	2.5 V

TPA6130A2 Series

138-mW, stereo, analog input headphone amplifier with I2C control interface

Part	Type	Supplier Device Package	Voltage - Supply [Min]	Voltage - Supply [Max]	Operating Temperature [Max]	Operating Temperature [Min]	Package / Case	Features	Output Type	Mounting Type	Max Output Power x Channels @ Load [custom]	Supplier Device Package [x]	Supplier Device Package [y]
Texas Instruments TPA6130A2RTJTG4	Class AB	20-QFN (4x4)	2.5 V	5.5 V	85 °C	-40 °C	20-WFQFN Exposed Pad	Depop Differential Inputs I2C Mute Short-Circuit and Thermal Protection Shutdown Volume Control	Headphones 2-Channel (Stereo)	Surface Mount	138 mW 290 mW
Texas Instruments TPA6130A2RTJRG4	Class AB	20-QFN (4x4)	2.5 V	5.5 V	85 °C	-40 °C	20-WFQFN Exposed Pad	Depop Differential Inputs I2C Mute Short-Circuit and Thermal Protection Shutdown Volume Control	Headphones 2-Channel (Stereo)	Surface Mount	138 mW 290 mW
Texas Instruments TPA6130A2YZHR	Class AB	16-DSBGA	2.5 V	5.5 V	85 °C	-40 °C	16-UFBGA DSBGA	Depop Differential Inputs I2C Mute Short-Circuit and Thermal Protection Shutdown Volume Control	Headphones 2-Channel (Stereo)	Surface Mount	138 mW 290 mW	2.24	2.16
Texas Instruments TPA6130A2YZHT	Class AB	16-DSBGA	2.5 V	5.5 V	85 °C	-40 °C	16-UFBGA DSBGA	Depop Differential Inputs I2C Mute Short-Circuit and Thermal Protection Shutdown Volume Control	Headphones 2-Channel (Stereo)	Surface Mount	138 mW 290 mW	2.24	2.16
Texas Instruments TPA6130A2RTJR	Class AB	20-QFN (4x4)	2.5 V	5.5 V	85 °C	-40 °C	20-WFQFN Exposed Pad	Depop Differential Inputs I2C Mute Short-Circuit and Thermal Protection Shutdown Volume Control	Headphones 2-Channel (Stereo)	Surface Mount	138 mW 290 mW
Texas Instruments TPA6130A2RTJT	Class AB	20-QFN (4x4)	2.5 V	5.5 V	85 °C	-40 °C	20-WFQFN Exposed Pad	Depop Differential Inputs I2C Mute Short-Circuit and Thermal Protection Shutdown Volume Control	Headphones 2-Channel (Stereo)	Surface Mount	138 mW 290 mW

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	500	$ 1.08
		1250	$ 0.90
		2500	$ 0.83
		6250	$ 0.80
		12500	$ 0.77

Description

General part information

TPA6130A2 Series

The TPA6130A2 is a stereo DirectPath™ headphone amplifier with I2C digital volume control. The TPA6130A2 has minimal quiescent current consumption, with a typical IDDof 4 mA, making it optimal for portable applications. The I2C control allows maximum flexibility with a 64 step audio taper volume control, channel independent enables and mutes, and the ability to configure the outputs into stereo, dual mono, or a single receiver speaker BTL amplifier that drives 300 mW of power into 16 Ω loads.

The TPA6130A2 is a high fidelity amplifier with an SNR of 98 dB. A PSRR greater than 100 dB enables direct-to-battery connections without compromising the listening experience. The output noise of 9 µVrms (typicalA-weighted) provides a minimal noise background during periods of silence. Configurable differential inputs and high CMRR allow for maximum noise rejection in the noisy environment of a mobile device.

TPA6130A2 packaging includes a 2 by 2 mm chip-scale package, and a 4 by 4 mm QFN package.

Documents

Technical documentation and resources

No documents available