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SC-62_MPT3
Discrete Semiconductor Products

DTDG14GPT100

Active
Rohm Semiconductor

NPN, SOT-89, R2 ALONE TYPE DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

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Search across all available documentation for this part.

SC-62_MPT3
Discrete Semiconductor Products

DTDG14GPT100

Active
Rohm Semiconductor

NPN, SOT-89, R2 ALONE TYPE DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationDTDG14GPT100
Current - Collector (Ic) (Max) [Max]1 A
Current - Collector Cutoff (Max) [Max]500 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]300
Frequency - Transition80 MHz
Mounting TypeSurface Mount
Package / CaseTO-243AA
Power - Max [Max]2 W
Resistor - Emitter Base (R2)10 kOhms
Supplier Device PackageMPT3
Transistor TypeNPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic400 mV
Voltage - Collector Emitter Breakdown (Max) [Max]60 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.59
10$ 0.51
100$ 0.35
500$ 0.27
Digi-Reel® 1$ 0.59
10$ 0.51
100$ 0.35
500$ 0.27
Tape & Reel (TR) 1000$ 0.21
2000$ 0.19
3000$ 0.18
5000$ 0.17
7000$ 0.17

Description

General part information

DTDG14 Series

These are the standard products of "digital transistors" which ROHM invented and marketed first in the world.

Documents

Technical documentation and resources

MPT3 Part Marking

Related Document

MPT3 T100 Taping Spec

Datasheet

Transistor, MOSFET Flammability

Related Document

Report of SVHC under REACH Regulation

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

DTDG14GP Data Sheet

Data Sheet

PCB Layout Thermal Design Guide

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Package Dimensions

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

Inner Structure

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Export Regulations

Export Information

Anti-Whisker formation - Transistors

Package Information

How to Use LTspice® Models

Schematic Design & Verification

DTDG14GP Thermal Resistance

Characteristics Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Part Explanation

Application Note

Reliability Test Result

Manufacturing Data

What Is Thermal Design

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

How to Create Symbols for PSpice Models

Models

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Compliance of the RoHS directive

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Types and Features of Transistors

Application Note

List of Transistor Package Thermal Resistance

Thermal Design