Integrated Circuits (ICs)
MC33FS6522CAE
ActiveNXP USA Inc.
POWER MANAGEMENT SPECIALIZED - PMIC SYSTEM BASIS CHIP, DCDC 2.2A VCORE LDT CAN, LQFP48EP
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DocumentsMC33FS6522CAE | Datasheet
Integrated Circuits (ICs)
MC33FS6522CAE
ActiveNXP USA Inc.
POWER MANAGEMENT SPECIALIZED - PMIC SYSTEM BASIS CHIP, DCDC 2.2A VCORE LDT CAN, LQFP48EP
Deep-Dive with AI
DocumentsMC33FS6522CAE | Datasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | MC33FS6522CAE |
|---|---|
| Applications | System Basis Chip |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -40 °C |
| Package / Case | 48-LQFP Exposed Pad |
| Package Length | 7 mm |
| Package Name | 48-HLQFP |
| Package Width | 7 mm |
| Voltage - Supply (Maximum) | 5 V |
| Voltage - Supply (Minimum) | 1 V |
| Part | Package / Case | Voltage - Supply (Minimum) | Voltage - Supply (Maximum) | Applications | Operating Temperature (Max) | Operating Temperature (Min) | Mounting Type | Package Length | Package Name | Package Width | Grade | Qualification |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. | 48-LQFP Exposed Pad | 1 V | 5 V | System Basis Chip | 125 °C | -40 °C | Surface Mount | 7 mm | 48-HLQFP | 7 mm | ||
 NXP USA Inc. | 48-LQFP Exposed Pad | 1 V | 5 V | System Basis Chip | 150 °C | -40 °C | Surface Mount | 7 mm | 48-HLQFP | 7 mm | Automotive | AEC-Q100 |
NXP USA Inc. | 48-LQFP Exposed Pad | 1 V | 5 V | System Basis Chip | 150 °C | -40 °C | Surface Mount | 7 mm | 48-HLQFP | 7 mm | Automotive | AEC-Q100 |
NXP USA Inc. | 48-LQFP Exposed Pad | 1 V | 5 V | System Basis Chip | 150 °C | -40 °C | Surface Mount | 7 mm | 48-HLQFP | 7 mm | Automotive | AEC-Q100 |
NXP USA Inc. | 48-LQFP Exposed Pad | 1 V | 5 V | System Basis Chip | 125 °C | -40 °C | Surface Mount | 7 mm | 48-HLQFP | 7 mm | ||
 NXP USA Inc. | 48-LQFP Exposed Pad | 1 V | 5 V | System Basis Chip | 125 °C | -40 °C | Surface Mount | 7 mm | 48-HLQFP | 7 mm | Automotive | AEC-Q100 |
NXP USA Inc. | 48-LQFP Exposed Pad | 1 V | 5 V | System Basis Chip | 125 °C | -40 °C | Surface Mount | 7 mm | 48-HLQFP | 7 mm | ||
NXP USA Inc. | 48-LQFP Exposed Pad | 1 V | 5 V | System Basis Chip | 125 °C | -40 °C | Surface Mount | 7 mm | 48-HLQFP | 7 mm | Automotive | AEC-Q100 |
NXP USA Inc. | 48-LQFP Exposed Pad | 1 V | 5 V | System Basis Chip | 150 °C | -40 °C | Surface Mount | 7 mm | 48-HLQFP | 7 mm | Automotive | AEC-Q100 |
NXP USA Inc. | 48-LQFP Exposed Pad | 1 V | 5 V | System Basis Chip | 125 °C | -40 °C | Surface Mount | 7 mm | 48-HLQFP | 7 mm | Automotive | AEC-Q100 |
Pricing
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CAD
3D models and CAD resources for this part
Description
General part information
FS6500 Series
POWER MANAGEMENT SPECIALIZED - PMIC SYSTEM BASIS CHIP, DCDC 2.2A VCORE LDT CAN, LQFP48EP
Documents
Technical documentation and resources