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ROHM R6030ENXC7G
Discrete Semiconductor Products

R6013VNXC7G

Active
Rohm Semiconductor

600V 8A TO-220FM, PRESTOMOS™ WITH INTEGRATED HIGH-SPEED DIODE

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ROHM R6030ENXC7G
Discrete Semiconductor Products

R6013VNXC7G

Active
Rohm Semiconductor

600V 8A TO-220FM, PRESTOMOS™ WITH INTEGRATED HIGH-SPEED DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationR6013VNXC7G
Current - Continuous Drain (Id) @ 25°C8 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)15 V, 10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs21 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]900 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-220-3 Full Pack
Power Dissipation (Max)54 W
Rds On (Max) @ Id, Vgs300 mOhm
Supplier Device PackageTO-220FM
TechnologyMOSFET (Metal Oxide)
Vgs (Max)30 V
Vgs(th) (Max) @ Id6.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1077$ 1.82
MouserN/A 1$ 1.82
10$ 1.51
50$ 1.47
NewarkEach 1$ 3.15
10$ 2.43
100$ 2.29
500$ 2.28
1000$ 2.27
3000$ 2.26
5000$ 2.25

Description

General part information

R6013VNX Series

R6013VNX is a power MOSFET with fast reverse recovery time (trr), suitable for the switching applications.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

How to Use LTspice® Models

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Benefits given by PrestoMOS™ series for the Phase-Shift Full-Bridge

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Explanation for Marking

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

About Export Regulations

Export Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

R6013VNX ESD Data

Characteristics Data

Moisture Sensitivity Level - Transistors

Package Information

Package Dimensions

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Compliance of the RoHS directive

Environmental Data

Anti-Whisker formation - Transistors

Package Information

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Judgment Criteria of Thermal Evaluation

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Part Explanation

Application Note

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

What Is Thermal Design

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

List of Transistor Package Thermal Resistance

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Types and Features of Transistors

Application Note

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design