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4-XBGA-YFF
Sensors, Transducers

TMP144YFFT

Obsolete
Texas Instruments

LOW-POWER, DIGITAL TEMPERATURE SENSOR WITH SMAART WIRE™ / UART INTERFACE

4-XBGA-YFF
Sensors, Transducers

TMP144YFFT

Obsolete
Texas Instruments

LOW-POWER, DIGITAL TEMPERATURE SENSOR WITH SMAART WIRE™ / UART INTERFACE

Technical Specifications

Parameters and characteristics for this part

SpecificationTMP144YFFT
Accuracy - Highest (Lowest)1 °C, 2 ¯C
FeaturesOne-Shot, Shutdown Mode
Mounting TypeSurface Mount
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Output TypeUART, SMAART Wire
Package / Case4-UFBGA, DSBGA
Resolution12 b
Sensing Temperature - Local [Max]125 °C
Sensing Temperature - Local [Min]-40 °C
Sensor TypeDigital, Local
Supplier Device Package4-DSBGA
Test Condition [Max]100 °C
Test Condition [Max]125 °C
Test Condition [Min]-10 °C
Test Condition [Min]-40 °C
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]1.4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.45
10$ 1.09
25$ 0.87
Digi-Reel® 1$ 1.45
10$ 1.09
25$ 0.87
Tape & Reel (TR) 250$ 0.73
500$ 0.67
750$ 0.64
1250$ 0.60
2500$ 0.58
Texas InstrumentsSMALL T&R 1$ 0.89
100$ 0.68
250$ 0.50
1000$ 0.36

Description

General part information

TMP144 Series

The TMP144 digital output temperature sensor can read temperatures to a resolution of 0.0625°C.

The device has a SMAART Wire™ / UART interface that supports daisy-chain configurations. The interface also supports Multiple Device Access (MDA) commands that let the host communicate with multiple devices on the bus simultaneously. MDA commands are used as an alternative to sending individual commands to each device on the bus. Up to 16 TMP144 devices can be attached together serially and can be read by the host computer.

The TMP144 device is designed for space-constrained, power-sensitive applications with multiple temperature measurement zones that must be monitored. The device is specified for operation over a temperature range of –40°C to 125°C and is available in three different 4-ball, low-height wafer chip-scale package (DSBGA) options. The YMT package of the device has a height of 150 µm, which is 40% thinner than a 0201 resistor. The thinner YMT package can be placed under heat-dissipating components on the system for better accuracy and faster thermal response times.