Circuit Protection

SF-0603FP125-2

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FUSE CHIP FAST ACTING 1.25A 32V SMD SOLDER PAD 0603 CERAMIC T/R

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Circuit Protection

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FUSE CHIP FAST ACTING 1.25A 32V SMD SOLDER PAD 0603 CERAMIC T/R

Technical Specifications

Parameters and characteristics for this part

Specification	SF-0603FP125-2

Approval Agency	UL
Breaking Capacity @ Rated Voltage	50 A
Current Rating (Amps)	1.25 A
Fuse Type	Board Mount (Cartridge Style Excluded)
Melting I²t	0.027
Mounting Type	Surface Mount
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-40 C
Package / Case	1608 Metric
Package / Case	0603
Response Time	Fast Blow
Size / Dimension [x]	0.063 "
Size / Dimension [x]	1.6 mm
Size / Dimension [y]	0.032 in
Size / Dimension [y]	0.8 mm
Voltage Rating - DC	32 V

Part	Size / Dimension [y]	Size / Dimension [x]	Size / Dimension [x]	Size / Dimension [y]	Package / Case	Package / Case	Operating Temperature [Min]	Operating Temperature [Max]	Fuse Type	Response Time	Mounting Type	Melting I²t	Approval Agency	Voltage Rating - DC	Breaking Capacity @ Rated Voltage	Current Rating (Amps)
Bourns Inc. SF-0603FP125-2	0.032 in	0.063 "	1.6 mm	0.8 mm	1608 Metric	0603	-40 C	105 ░C	Board Mount (Cartridge Style Excluded)	Fast Blow	Surface Mount	0.027	UL	32 V	50 A	1.25 A
Bourns Inc. SF-0603FP400-2	0.032 in	0.063 "	1.6 mm	0.8 mm	1608 Metric	0603	-40 C	105 ░C	Board Mount (Cartridge Style Excluded)	Fast Blow	Surface Mount	0.239	UL	32 V	50 A	4 A

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	8481	$ 0.95
Mouser	N/A	20000	$ 0.33
Newark	Each (Supplied on Cut Tape)	1	$ 0.48

General part information

FUSE CHIP FAST ACTING 1.25A 32V SMD SOLDER PAD 0603 CERAMIC T/R

Technical documentation and resources