Connectors, Interconnects

514-83-357M19-001148

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Preci-Dip

CONN SOCKET BGA 357POS GOLD

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Connectors, Interconnects

514-83-357M19-001148

Active

Preci-Dip

CONN SOCKET BGA 357POS GOLD

Deep-Dive with AI

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	514-83-357M19-001148

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating [custom]	29.5 µin
Contact Finish Thickness - Mating [custom]	0.75 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Contact Resistance	10 mOhm
Current Rating (Amps)	1 A
Features	Open Frame
Housing Material	Polyester, Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions or Pins (Grid) [custom]	357
Number of Positions or Pins (Grid) [x]	19
Number of Positions or Pins (Grid) [y]	19
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.055 in
Termination Post Length	1.4 mm
Type	BGA

514-83 Series

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Contact Resistance	Number of Positions or Pins (Grid)	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating [custom]	Contact Finish Thickness - Mating [custom]	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Contact Material - Mating	Mounting Type	Housing Material	Contact Finish - Post	Contact Finish - Mating	Type	Features	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Preci-Dip 514-83-419-19-001154	0.055 in	1.4 mm	1 A	UL94 V-0	10 mOhm	419	0.1 "	2.54 mm	29.5 µin	0.75 µm	Brass	0.1 in	2.54 mm	Beryllium Copper	Surface Mount	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Tin	Gold	PGA	Open Frame	-55 C	125 °C	Solder
Preci-Dip 514-83-078-13-061117	0.055 in	1.4 mm	1 A	UL94 V-0	10 mOhm	78	0.1 "	2.54 mm	29.5 µin	0.75 µm	Brass	0.1 in	2.54 mm	Beryllium Copper	Surface Mount	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Tin	Gold	PGA	Open Frame	-55 C	125 °C	Solder	13	13
Preci-Dip 514-83-478M26-131148	0.055 in	1.4 mm	1 A	UL94 V-0	10 mOhm	478	0.1 "	2.54 mm	29.5 µin	0.75 µm	Brass	0.1 in	2.54 mm	Beryllium Copper	Surface Mount	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Tin	Gold	BGA	Open Frame	-55 C	125 °C	Solder	26	26
Preci-Dip 514-83-357M19-001148	0.055 in	1.4 mm	1 A	UL94 V-0	10 mOhm		0.1 "	2.54 mm	29.5 µin	0.75 µm	Brass	0.1 in	2.54 mm	Beryllium Copper	Surface Mount	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Tin	Gold	BGA	Open Frame	-55 C	125 °C	Solder	19	19	357
Preci-Dip 514-83-272M20-001148	0.055 in	1.4 mm	1 A	UL94 V-0	10 mOhm	272	0.1 "	2.54 mm	29.5 µin	0.75 µm	Brass	0.1 in	2.54 mm	Beryllium Copper	Surface Mount	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Tin	Gold	BGA	Open Frame	-55 C	125 °C	Solder				20 x 20
Preci-Dip 514-83-432M31-001148	0.055 in	1.4 mm	1 A	UL94 V-0	10 mOhm	432	0.1 "	2.54 mm	29.5 µin	0.75 µm	Brass	0.1 in	2.54 mm	Beryllium Copper	Surface Mount	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Tin	Gold	BGA	Open Frame	-55 C	125 °C	Solder	31	31
Preci-Dip 514-83-145-15-081117	0.055 in	1.4 mm	1 A	UL94 V-0	10 mOhm	145	0.1 "	2.54 mm	29.5 µin	0.75 µm	Brass	0.1 in	2.54 mm	Beryllium Copper	Surface Mount	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Tin	Gold	PGA	Open Frame	-55 C	125 °C	Solder
Preci-Dip 514-83-321-19-121154	0.055 in	1.4 mm	1 A	UL94 V-0	10 mOhm	321	0.1 "	2.54 mm	29.5 µin	0.75 µm	Brass	0.1 in	2.54 mm	Beryllium Copper	Surface Mount	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Tin	Gold	PGA	Open Frame	-55 C	125 °C	Solder
Preci-Dip 514-83-504M29-001148	0.055 in	1.4 mm	1 A	UL94 V-0	10 mOhm	504	0.1 "	2.54 mm	29.5 µin	0.75 µm	Brass	0.1 in	2.54 mm	Beryllium Copper	Surface Mount	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Tin	Gold	BGA	Open Frame	-55 C	125 °C	Solder	29	29
Preci-Dip 514-83-456M26-001148	0.055 in	1.4 mm	1 A	UL94 V-0	10 mOhm		0.1 "	2.54 mm	29.5 µin	0.75 µm	Brass	0.1 in	2.54 mm	Beryllium Copper	Surface Mount	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Tin	Gold	BGA	Open Frame	-55 C	125 °C	Solder	26	26			456

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	756	$ 46.00
	N/A	0	$ 49.33

Description

General part information

514-83 Series

357 (19 x 19) Pos BGA Socket Gold Surface Mount

Documents

Technical documentation and resources

No documents available