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BM63767S-VA
Discrete Semiconductor Products

BM63767S-VA

Active
Rohm Semiconductor

600V IGBT INTELLIGENT POWER MODULE (IPM) FOR HIGH SPEED SWITCHING DRIVE

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Search across all available documentation for this part.

Documents4 Steps for Successful Thermal Designing of Power DevicesBM63767S-VA Data Sheet+23
BM63767S-VA
Discrete Semiconductor Products

BM63767S-VA

Active
Rohm Semiconductor

600V IGBT INTELLIGENT POWER MODULE (IPM) FOR HIGH SPEED SWITCHING DRIVE

Deep-Dive with AI

Documents4 Steps for Successful Thermal Designing of Power DevicesBM63767S-VA Data Sheet+23

Technical Specifications

Parameters and characteristics for this part

SpecificationBM63767S-VA
Configuration3 Phase Inverter
Current30 A
Mounting TypeThrough Hole
Package / Case25-PowerDIP Module (1.134", 28.80mm)
TypeIGBT
Voltage600 V
Voltage - Isolation1500 VAC

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 27.91
MouserN/A 1$ 26.90
10$ 23.91
25$ 20.75
120$ 18.54

Description

General part information

BM63767S-VA Series

BM63767S-VA is an Intelligent Power Module composed of gate drivers, bootstrap diodes, IGBTs, fly wheel diodes.

Documents

Technical documentation and resources

4 Steps for Successful Thermal Designing of Power Devices

White Paper

BM63767S-VA Data Sheet

Data Sheet

What Is Thermal Design

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

About Flammability of Materials

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

About Export Administration Regulations (EAR)

Export Information

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Reliability Test Result

Manufacturing Data

Compliance of the ELV directive

Environmental Data

Judgment Criteria of Thermal Evaluation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Constitution Materials List

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Anti-Whisker formation

Package Information