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Discrete Semiconductor Products

RX3N07BBHC16

Active
Rohm Semiconductor

MOSFET, N-CHANNEL, 80V, 100A, TO-220AB ROHS COMPLIANT: YES

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Product thumbnail image
Discrete Semiconductor Products

RX3N07BBHC16

Active
Rohm Semiconductor

MOSFET, N-CHANNEL, 80V, 100A, TO-220AB ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationRX3N07BBHC16
Current - Continuous Drain (Id) @ 25°C70 A
Current - Continuous Drain (Id) @ 25°C100 A
Drain to Source Voltage (Vdss)80 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 6 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]46 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]3280 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-220-3
Rds On (Max) @ Id, Vgs5.1 mOhm
Supplier Device PackageTO-220AB
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 990$ 3.95
NewarkEach 1$ 3.40
10$ 2.42
100$ 1.86
500$ 1.61
1000$ 1.47
3000$ 1.42
5000$ 1.38

Description

General part information

RX3N07BBH Series

RX3N07BBH is a power MOSFET with low on-resistance and high power package, suitable for switching, motor drives and DC/DC converter.

Documents

Technical documentation and resources

RX3N07BBH ESD Data

Characteristics Data

Compliance of the RoHS directive

Environmental Data

How to Use LTspice® Models

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

What Is Thermal Design

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Report of SVHC under REACH Regulation

Environmental Data

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Anti-Whisker formation - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Types and Features of Transistors

Application Note

Part Explanation

Application Note

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

RX3N07BBH Data Sheet

Data Sheet

TO-220AB Dimension

Package Information

About Export Regulations

Export Information

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

TO-220AB Explanation for Marking

Package Information

About Flammability of Materials

Environmental Data

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

TO-220AB Inner Structure

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

TO-220AB Packing Information

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

TO-220AB Reliability Test Result

Manufacturing Data