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RGPR30NS40HRTL
Discrete Semiconductor Products

RGPR30NS40HRTL

Active
Rohm Semiconductor

IGBT, 30 A, 1.6 V, 125 W, 430 V, TO-263 (D2PAK), 3 PINS

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RGPR30NS40HRTL
Discrete Semiconductor Products

RGPR30NS40HRTL

Active
Rohm Semiconductor

IGBT, 30 A, 1.6 V, 125 W, 430 V, TO-263 (D2PAK), 3 PINS

Technical Specifications

Parameters and characteristics for this part

SpecificationRGPR30NS40HRTL
Current - Collector (Ic) (Max) [Max]30 A
Gate Charge22 nC
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263-3, TO-263AB
QualificationAEC-Q101
Supplier Device PackageLPDS
Td (on/off) @ 25°C4 µs, 500 ns
Test Condition8 A, 100 Ohm, 300 V, 5 V
Vce(on) (Max) @ Vge, Ic2 V
Voltage - Collector Emitter Breakdown (Max) [Max]430 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1082$ 2.71
NewarkEach (Supplied on Cut Tape) 1$ 2.28
10$ 1.77
25$ 1.65
50$ 1.55
100$ 1.44
250$ 1.34
500$ 1.28
1000$ 1.22

Description

General part information

RGPR30NS40HR Series

RGPR30NS40 is a Ignition IGBT with low collector - emitter saturation voltage, suitable for Ignition Coil Driver Circuits, Solenoid Driver Circuits. It is a highly reliable product for automotive.

Documents

Technical documentation and resources

Anti-Whisker formation

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Package Dimensions

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Part Explanation

Application Note

Types and Features of Transistors

Application Note

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

What Is Thermal Design

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

RGPR30NS40HR Data Sheet

Data Sheet

Compliance of the ELV directive

Environmental Data

How to Use LTspice&reg; Models

Schematic Design & Verification

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Moisture Sensitivity Level

Package Information

About Export Administration Regulations (EAR)

Export Information

How to Create Symbols for PSpice Models

Models

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

What is a Thermal Model? (IGBT)

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design