Integrated Circuits (ICs)

R9A06G064SGBG#BC0

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SOC R-IN CL3 CC-LINK IE TSN

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Integrated Circuits (ICs)

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SOC R-IN CL3 CC-LINK IE TSN

Technical Specifications

Parameters and characteristics for this part

Specification	R9A06G064SGBG#BC0

Connectivity	CSI, UART/USART, Ethernet, CANbus, SPI, I2C, EBI/EMI
Core Processor	ARM® Cortex®-M4F
Core Size	32-Bit
Mounting Type	Surface Mount
Number of I/O	101
Operating Temperature [Max]	85 C
Operating Temperature [Min]	-40 ¯C
Oscillator Type	External, Internal
Package / Case	356-FBGA
Peripherals	PWM, DMA, WDT
Program Memory Size	768 KB
Program Memory Type	RAM
RAM Size	512 K
Speed	100 MHz
Supplier Device Package	356-FBGA (17x17)
Voltage - Supply (Vcc/Vdd) [Max]	2.625 V, 3.465 V, 1.21 V
Voltage - Supply (Vcc/Vdd) [Min]	1.09 V, 3.135 V, 2.375 V

Part	Operating Temperature [Max]	Operating Temperature [Min]	Core Size	Mounting Type	Program Memory Type	Connectivity	Package / Case	Supplier Device Package	RAM Size	Program Memory Size	Oscillator Type	Number of I/O	Speed	Core Processor	Peripherals	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]
Renesas Electronics Corporation R9A06G064SGBG#BC0	85 C	-40 ¯C	32-Bit	Surface Mount	RAM	CANbus CSI EBI/EMI Ethernet I2C SPI UART/USART	356-FBGA	356-FBGA (17x17)	512 K	768 KB	External Internal	101	100 MHz	ARM® Cortex®-M4F	DMA PWM WDT	1.21 V 2.625 V 3.465 V	1.09 V 2.375 V 3.135 V

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

ARM® Cortex®-M4F - Microcontroller IC 32-Bit 100MHz 768KB (768K x 8) RAM 356-FBGA (17x17)

Technical documentation and resources