R9A06G064SGBG#BC0

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SOC R-IN CL3 CC-LINK IE TSN

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Integrated Circuits (ICs)

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SOC R-IN CL3 CC-LINK IE TSN

Technical Specifications

Parameters and characteristics for this part

Specification	R9A06G064SGBG#BC0

Connectivity	SPI, CSI, EBI/EMI, CANbus, Ethernet, UART/USART, I2C
Core Processor	ARM® Cortex®-M4F
Core Size	32-Bit
Mounting Type	Surface Mount
Number of I/O	101
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	External, Internal
Package / Case	356-FBGA
Peripherals	WDT, PWM, DMA
Program Memory Size	768 KB
Program Memory Type	RAM
RAM Size	512 K
Speed	100 MHz
Supplier Device Package	356-FBGA (17x17)
Voltage - Supply (Vcc/Vdd) [Max]	2.625 V, 1.21 V, 3.465 V
Voltage - Supply (Vcc/Vdd) [Min]	2.375 V, 1.09 V, 3.135 V

Part	Supplier Device Package	Oscillator Type	Package / Case	Mounting Type	RAM Size	Number of I/O	Operating Temperature [Max]	Operating Temperature [Min]	Speed	Connectivity	Peripherals	Program Memory Type	Program Memory Size	Voltage - Supply (Vcc/Vdd) [Min]	Voltage - Supply (Vcc/Vdd) [Max]	Core Size	Core Processor
Renesas Electronics Corporation R9A06G064SGBG#BC0	356-FBGA (17x17)	External Internal	356-FBGA	Surface Mount	512 K	101	85 °C	-40 °C	100 MHz	CANbus CSI EBI/EMI Ethernet I2C SPI UART/USART	DMA PWM WDT	RAM	768 KB	1.09 V 2.375 V 3.135 V	1.21 V 2.625 V 3.465 V	32-Bit	ARM® Cortex®-M4F

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

ARM® Cortex®-M4F - Microcontroller IC 32-Bit 100MHz 768KB (768K x 8) RAM 356-FBGA (17x17)

Technical documentation and resources