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8-SOIC

Integrated Circuits (ICs)

BR25H640FJ-5ACE2

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Rohm Semiconductor

64KBIT, SPI BUS, HIGH SPEED WRITE CYCLE, HIGH ENDURANCE, SERIAL EEPROM FOR AUTOMOTIVE (125℃ OPERATION)

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Search across all available documentation for this part.

DocumentsImpedance Characteristics of Bypass Capacitor What Is Thermal Design +12

8-SOIC

Integrated Circuits (ICs)

BR25H640FJ-5ACE2

Active

Rohm Semiconductor

64KBIT, SPI BUS, HIGH SPEED WRITE CYCLE, HIGH ENDURANCE, SERIAL EEPROM FOR AUTOMOTIVE (125℃ OPERATION)

Deep-Dive with AI

DocumentsImpedance Characteristics of Bypass Capacitor What Is Thermal Design +12

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	BR25H640FJ-5ACE2

Clock Frequency	20 MHz
Memory Format	EEPROM
Memory Interface	SPI
Memory Organization	8K x 8
Memory Size	64 Kbit
Memory Type	Non-Volatile
Mounting Type	Surface Mount
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Package / Case	0.154 in
Package / Case	8-SOIC
Package / Case	3.9 mm
Supplier Device Package	8-SOP-J
Technology	EEPROM
Voltage - Supply [Max]	5.5 V
Voltage - Supply [Min]	1.7 V
Write Cycle Time - Word, Page	3.5 ms

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 0.93
		10	$ 0.83
		25	$ 0.79
		50	$ 0.76
		100	$ 0.73
		250	$ 0.70
		500	$ 0.67
		1000	$ 0.65
	Digi-Reel®	1	$ 0.93
		10	$ 0.83
		25	$ 0.79
		50	$ 0.76
		100	$ 0.73
		250	$ 0.70
		500	$ 0.67
		1000	$ 0.65
	N/A	1867	$ 0.77
	Tape & Reel (TR)	2500	$ 0.62
		5000	$ 0.60
		7500	$ 0.59
		12500	$ 0.57
		17500	$ 0.56
Newark	Each (Supplied on Cut Tape)	1	$ 0.82
		10	$ 0.77
		25	$ 0.75
		50	$ 0.73
		100	$ 0.72
		250	$ 0.70
		500	$ 0.68
		1000	$ 0.66

Description

General part information

BR25H640 Series

BR25H640xxx-5AC Series is a 64 kbit serial EEPROM of SPI BUS Interface.

Documents

Technical documentation and resources

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What Is Thermal Design

Thermal Resistance

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Factory Information

Manufacturing Data

BR25H640FJ-5AC Data Sheet

Design Guide and Example of Stencil for Exposed Pad

SOP-J8 Package Information

Package Information

Basics of Thermal Resistance and Heat Dissipation

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Opcode, Address, and Page Configuration for SPI BUS EEPROM

Schematic Design & Verification

Five Steps for Successful Thermal Design of IC

Solder Joint Rate and Thermal Resistance of Exposed Pad

BR25H640 Series

64KBit, SPI BUS, High Speed Write Cycle, High Endurance, Serial EEPROM for Automotive (125℃ Operation)

Part	Memory Organization	Memory Format	Technology	Supplier Device Package	Mounting Type	Write Cycle Time - Word, Page	Memory Type	Package / Case	Package / Case	Package / Case	Voltage - Supply [Min]	Voltage - Supply [Max]	Clock Frequency	Operating Temperature [Max]	Operating Temperature [Min]	Memory Size	Memory Interface	Qualification	Grade
Rohm Semiconductor BR25H640FJ-5ACE2	8K x 8	EEPROM	EEPROM	8-SOP-J	Surface Mount	3.5 ms	Non-Volatile	0.154 in	8-SOIC	3.9 mm	1.7 V	5.5 V	20 MHz	125 °C	-40 °C	64 Kbit	SPI
Rohm Semiconductor BR25H640F-2CE2	8K x 8	EEPROM	EEPROM	8-SOP	Surface Mount	4 ms	Non-Volatile		8-SOIC (0.173" 4.40mm Width)		2.5 V	5.5 V	10 MHz	125 °C	-40 °C	64 Kbit	SPI	AEC-Q100	Automotive
Rohm Semiconductor BR25H640FVT-5ACE2	8K x 8	EEPROM	EEPROM	8-TSSOP-B	Surface Mount	3.5 ms	Non-Volatile	0.173 in	8-TSSOP	4.4 mm	1.7 V	5.5 V	20 MHz	125 °C	-40 °C	64 Kbit	SPI	AEC-Q100	Automotive
Rohm Semiconductor BR25H640F-2LBH2	8K x 8	EEPROM	EEPROM	8-SOP	Surface Mount	4 ms	Non-Volatile	0.154 in	8-SOIC	3.9 mm	2.5 V	5.5 V	5 MHz	125 °C	-40 °C	64 Kbit	SPI
Rohm Semiconductor BR25H640FVT-2CE2	8K x 8	EEPROM	EEPROM	8-TSSOP-B	Surface Mount	4 ms	Non-Volatile	0.173 in	8-TSSOP	4.4 mm	2.5 V	5.5 V	10 MHz	125 °C	-40 °C	64 Kbit	SPI	AEC-Q100	Automotive
Rohm Semiconductor BR25H640FVM-5ACTR	8K x 8	EEPROM	EEPROM	8-MSOP	Surface Mount	3.5 ms	Non-Volatile		8-MSOP 8-VSSOP		1.7 V	5.5 V	20 MHz	125 °C	-40 °C	64 Kbit	SPI
Rohm Semiconductor BR25H640FVT-2ACE2	8K x 8	EEPROM	EEPROM	8-TSSOP-B	Surface Mount	4 ms	Non-Volatile	0.173 in	8-TSSOP	4.4 mm	2.5 V	5.5 V	10 MHz	125 °C	-40 °C	64 Kbit	SPI	AEC-Q100	Automotive
Rohm Semiconductor BR25H640F-2ACE2	8K x 8	EEPROM	EEPROM	8-SOP	Surface Mount	4 ms	Non-Volatile		8-SOIC (0.173" 4.40mm Width)		2.5 V	5.5 V	10 MHz	125 °C	-40 °C	64 Kbit	SPI	AEC-Q100	Automotive
Rohm Semiconductor BR25H640FVM-2ACTR	8K x 8	EEPROM	EEPROM	8-MSOP	Surface Mount	4 ms	Non-Volatile		8-MSOP 8-VSSOP		2.5 V	5.5 V	10 MHz	125 °C	-40 °C	64 Kbit	SPI	AEC-Q100	Automotive
Rohm Semiconductor BR25H640FJ-2ACE2	8K x 8	EEPROM	EEPROM	8-SOP-J	Surface Mount	4 ms	Non-Volatile	0.154 in	8-SOIC	3.9 mm	2.5 V	5.5 V	10 MHz	125 °C	-40 °C	64 Kbit	SPI	AEC-Q100	Automotive