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Discrete Semiconductor Products

UMT3904T106

Active
Rohm Semiconductor

BIPOLAR (BJT) SINGLE TRANSISTOR, NPN, 40 V, 200 MA, 200 MW, SOT-323, SURFACE MOUNT

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Product schematic image
Discrete Semiconductor Products

UMT3904T106

Active
Rohm Semiconductor

BIPOLAR (BJT) SINGLE TRANSISTOR, NPN, 40 V, 200 MA, 200 MW, SOT-323, SURFACE MOUNT

Technical Specifications

Parameters and characteristics for this part

SpecificationUMT3904T106
Current - Collector (Ic) (Max) [Max]200 mA
Current - Collector Cutoff (Max) [Max]50 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]100
Frequency - Transition300 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-323, SC-70
Power - Max [Max]200 mW
Supplier Device PackageUMT3
Transistor TypeNPN
Vce Saturation (Max) @ Ib, Ic0.3 V
Voltage - Collector Emitter Breakdown (Max) [Max]40 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 58536$ 0.33
NewarkEach 1$ 0.34
10$ 0.21
100$ 0.13
500$ 0.10
1000$ 0.08
2500$ 0.07
12000$ 0.06
27000$ 0.05

Description

General part information

UMT3904 Series

Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.

Documents

Technical documentation and resources

List of Transistor Package Thermal Resistance

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Compliance of the RoHS directive

Environmental Data

Anti-Whisker formation - Transistors

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

UMT3904 Data Sheet

Data Sheet

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Taping Information

Package Information

About Export Regulations

Export Information

Moisture Sensitivity Level - Transistors

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Package Dimensions

Package Information

How to Use LTspice® Models

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Part Explanation

Application Note

PCB Layout Thermal Design Guide

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Inner Structure

Package Information

Explanation for Marking

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Types and Features of Transistors

Application Note

What is a Thermal Model? (Transistor)

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Certificate of not containing SVHC under REACH Regulation

Environmental Data

ESD Data

Characteristics Data

About Flammability of Materials

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

What Is Thermal Design

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Two-Resistor Model for Thermal Simulation

Thermal Design