Integrated Circuits (ICs)

TE0807-03-4AI21-A

Unknown

MPSOC ZYNQ USCALE 4GB DDR4

Integrated Circuits (ICs)

Unknown

MPSOC ZYNQ USCALE 4GB DDR4

Technical Specifications

Parameters and characteristics for this part

Specification	TE0807-03-4AI21-A

Connector Type	B2B
Core Processor	Zynq UltraScale+ XCZU4CG-1FBVB900I
Flash Size	128 MB
Module/Board Type	MPU Core
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
RAM Size	4 GB
Size / Dimension Length	2.05 in
Size / Dimension Width	2.99 in

Part	Core Processor	Operating Temperature (Min)	Operating Temperature (Max)	Size / Dimension Length	Size / Dimension Width	Module/Board Type	Flash Size	Connector Type	RAM Size
Trenz Electronic TE0807-03-4AI21-A	Zynq UltraScale+ XCZU4CG-1FBVB900I	-40 °C	85 °C	2.05 in	2.99 in	MPU Core	128 MB	B2B	4 GB
Trenz Electronic TE0807-03-5AI21-A
Trenz Electronic TE0807-03-7DI21-A	Zynq UltraScale+ XCZU7EV-1FBVB900I	-40 °C	85 °C	2.05 in	2.99 in	MPU Core	128 MB	B2B	4 GB
Trenz Electronic TE0807-03-7AI21-A	Zynq UltraScale+ XCZU7CG-1FBVB900I	-40 °C	85 °C	2.05 in	2.99 in	MPU Core	128 MB	B2B	4 GB

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

Digikey	Box	1	$ 1307.01	<5d

3D models and CAD resources for this part

General part information

TE0807 Embedded Module Zynq UltraScale+ XCZU4CG-1FBVB900I 4GB 128MB

Technical documentation and resources

No documents available