
SN74LVC2G32YZPR
Active2-CH, 2-INPUT 1.65-V TO 5.5-V 32-MA DRIVE STRENGTH OR GATE
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SN74LVC2G32YZPR
Active2-CH, 2-INPUT 1.65-V TO 5.5-V 32-MA DRIVE STRENGTH OR GATE
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Technical Specifications
Parameters and characteristics for this part
| Specification | SN74LVC2G32YZPR |
|---|---|
| Current - Output High, Low [x] | 32 mA |
| Current - Output High, Low [y] | 32 mA |
| Current - Quiescent (Max) [Max] | 10 µA |
| Input Logic Level - High [Max] | 2 V |
| Input Logic Level - High [Min] | 1.7 V |
| Input Logic Level - Low [Max] | 0.8 V |
| Input Logic Level - Low [Min] | 0.7 V |
| Logic Type | OR Gate |
| Max Propagation Delay @ V, Max CL | 3.2 ns |
| Mounting Type | Surface Mount |
| Number of Circuits | 2 |
| Number of Inputs | 2 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 8-XFBGA, DSBGA |
| Supplier Device Package | 8-DSBGA |
| Voltage - Supply [Max] | 5.5 V |
| Voltage - Supply [Min] | 1.65 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 0.84 | |
| 10 | $ 0.75 | |||
| 25 | $ 0.71 | |||
| 100 | $ 0.58 | |||
| 250 | $ 0.55 | |||
| 500 | $ 0.48 | |||
| 1000 | $ 0.38 | |||
| Digi-Reel® | 1 | $ 0.84 | ||
| 10 | $ 0.75 | |||
| 25 | $ 0.71 | |||
| 100 | $ 0.58 | |||
| 250 | $ 0.55 | |||
| 500 | $ 0.48 | |||
| 1000 | $ 0.38 | |||
| Tape & Reel (TR) | 3000 | $ 0.35 | ||
| 6000 | $ 0.32 | |||
| 15000 | $ 0.31 | |||
| 30000 | $ 0.30 | |||
| Texas Instruments | LARGE T&R | 1 | $ 0.68 | |
| 100 | $ 0.46 | |||
| 250 | $ 0.36 | |||
| 1000 | $ 0.24 | |||
Description
General part information
SN74LVC2G32-Q1 Series
This dual two-input positive-OR gate is designed for 1.65-V to 5.5-V collector supply voltage operation.
The SN74LVC2G32-Q1 performs the Boolean function Y = A + B or Y =A\ • B\in positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Documents
Technical documentation and resources