DP270-BLACK-200ML
ActiveADHESIVE, EPOXY - 2 PART, BLACK, TEMPERATURE, CARTRIDGE, 200 ML
Deep-Dive with AI
Search across all available documentation for this part.
DP270-BLACK-200ML
ActiveADHESIVE, EPOXY - 2 PART, BLACK, TEMPERATURE, CARTRIDGE, 200 ML
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | DP270-BLACK-200ML |
|---|---|
| Features | Black |
| Features | 200 mL |
| For Use With/Related Products | Sealing Electronic Components |
| Shelf Life | 18 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | Due to possible restrictions, a change in ship method may be required. |
| Storage/Refrigeration Temperature [Max] | 27 °C |
| Storage/Refrigeration Temperature [Max] | 80 °F |
| Storage/Refrigeration Temperature [Min] | 60 °F |
| Storage/Refrigeration Temperature [Min] | 16 °C |
| Type | Potting Compound, 2 Part |
| Part | Shipping Info | Shelf Life Start | Shelf Life | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Min] | Type | Features | Features | For Use With/Related Products |
|---|---|---|---|---|---|---|---|---|---|---|---|
 3M Electronic Specialty | Due to possible restrictions a change in ship method may be required. | Date of Manufacture | 18 Months | 27 °C | 80 °F | 60 °F | 16 °C | Potting Compound 2 Part | Black | 50 mL | Sealing Electronic Components |
3M Electronic Specialty | Due to possible restrictions a change in ship method may be required. | Date of Manufacture | 18 Months | 27 °C | 80 °F | 60 °F | 16 °C | Potting Compound 2 Part | Black | 200 mL | Sealing Electronic Components |
 3M Electronic Specialty | Due to possible restrictions a change in ship method may be required. | Date of Manufacture | 18 Months | 27 °C | 80 °F | 60 °F | 16 °C | Potting Compound 2 Part | Black | 400 mL | Sealing Electronic Components |
 3M Electronic Specialty | Due to possible restrictions a change in ship method may be required. | Date of Manufacture | 18 Months | 27 °C | 80 °F | 60 °F | 16 °C | Potting Compound 2 Part | Clear | 200 mL | Sealing Electronic Components |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
DP270 Series
DP270-BLACK-200ML is a Scotch-Weld™ epoxy potting compound/adhesive. It is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components. It is noncorrosive to copper and offers good thermal shock resistance and excellent retention of electrical insulation properties under high humidity conditions. It has a work life of approximately 70minutes, a tack-free time of about 3hours and is fully cured after 48hours at 73°F (23°C). This product produces no exotherm in 5-10gram masses and a very slight exotherm in larger masses. It is ideal for the potting and encapsulation of many heat sensitive or delicate components such as glass diodes and sensors as well as for transformers, coils, chokes, relays, etc.
Documents
Technical documentation and resources