Specification	MC9S08LG32CLK

A/D Channels	16 count
A/D Resolution (bits)	12 bit
Connectivity	SCI, SPI, I2C
Core Processor	S08
Core Size (Bit Width)	8 Bit
Mounting Type	Surface Mount
Number of I/O	69
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal
Package / Case	80-LQFP
Package Length	14 mm
Package Name	80-LQFP
Package Width	14 mm
Peripherals	PWM, LCD, LVD
Program Memory Depth	32 K
Program Memory Size	32 KB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	1.9 K
RAM Size Width	8 bit
Speed	40 MHz
Voltage - Supply (Vcc/Vdd) Maximum	5.5 V
Voltage - Supply (Vcc/Vdd) Minimum	2.7 V

S08LG Series

Part	Mounting Type	Number of I/O	Package / Case	Speed	Oscillator Type	Package Width	Package Name	Package Length	Core Size (Bit Width)	Voltage - Supply (Vcc/Vdd) Minimum	Voltage - Supply (Vcc/Vdd) Maximum	Core Processor	Connectivity	Program Memory Size	Program Memory Width	Program Memory Depth	Program Memory Type	Operating Temperature (Max)	Operating Temperature (Min)	RAM Size Depth	RAM Size Width	A/D Resolution (bits)	A/D Channels	Peripherals
NXP USA Inc. MC9S08LG32CLK	Surface Mount	69	80-LQFP	40 MHz	Internal	14 mm	80-LQFP	14 mm	8 Bit	2.7 V	5.5 V	S08	I2C SCI SPI	32 KB	8 bit	32 K	FLASH	85 °C	-40 °C	1.9 K	8 bit	12 bit	16 count	LCD LVD PWM

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

Digikey	N/A	0	$ 5.03	1m+
		28	$ 5.03
Mouser	N/A	1	$ 4.62	1m+
		100	$ 4.61
Newark	Each	1	$ 5.49	1m+

3D models and CAD resources for this part

General part information

Up to 40 MHz HCS08 CPU up to 5V and across a temperature range of -40°C to +85°C

HCS08 instruction set with added BGND instruction

Integrated LCD driver supports both standard 3V and 5V LCD glass

Technical documentation and resources