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QS8M31TR
Discrete Semiconductor Products

QS8M31TR

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Rohm Semiconductor

MOSFETS TSMT8 DUAL CHAN 60V

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QS8M31TR
Discrete Semiconductor Products

QS8M31TR

Active
Rohm Semiconductor

MOSFETS TSMT8 DUAL CHAN 60V

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationQS8M31TR
ConfigurationN and P-Channel
Current - Continuous Drain (Id) @ 25°C2 A, 3 A
Drain to Source Voltage (Vdss)60 V
Gate Charge (Qg) (Max) @ Vgs4 nC, 7.2 nC
Input Capacitance (Ciss) (Max) @ Vds750 pF, 270 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Power - Max [Max]1.1 W
Rds On (Max) @ Id, Vgs112 mOhm, 210 mOhm
Supplier Device PackageTSMT8
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id3 V, 2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 3073$ 1.09
MouserN/A 1$ 1.07
10$ 0.73
100$ 0.49
250$ 0.49
500$ 0.39
1000$ 0.35
3000$ 0.31
6000$ 0.29

Description

General part information

QS8M31 Series

QS8M31 is complex type MOSFET(P+N) for switching application.

Documents

Technical documentation and resources

Application Note (PDF)

Application Notes

QS8M31 Data Sheet

Data Sheet

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

What Is Thermal Design

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Taping Information

Package Information

Part Explanation

Application Note

About Flammability of Materials

Environmental Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

About Export Regulations

Export Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Types and Features of Transistors

Application Note

Compliance of the RoHS directive

Environmental Data

Explanation for Marking

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Inner Structure

Package Information

How to Create Symbols for PSpice Models

Models

QS8M31 ESD Data

Characteristics Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Reliability Test Result

Manufacturing Data

Package Dimensions

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design