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RGWS80TS65DGC13
Discrete Semiconductor Products

RGWS80TS65DGC13

Active
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 40A, FRD BUILT-IN, TO-247GE, FIELD STOP TRENCH IGBT

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RGWS80TS65DGC13
Discrete Semiconductor Products

RGWS80TS65DGC13

Active
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 40A, FRD BUILT-IN, TO-247GE, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGWS80TS65DGC13
Current - Collector (Ic) (Max) [Max]71 A
Current - Collector Pulsed (Icm)120 A
Gate Charge83 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 °C
Package / CaseTO-247-3
Power - Max [Max]202 W
Reverse Recovery Time (trr)88 ns
Supplier Device PackageTO-247G
Switching Energy700 µJ, 660 µJ
Td (on/off) @ 25°C [custom]114 ns
Td (on/off) @ 25°C [custom]40 ns
Test Condition400 V, 10 Ohm, 15 V, 40 A
Vce(on) (Max) @ Vge, Ic2 V
Voltage - Collector Emitter Breakdown (Max) [Max]650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 575$ 6.70

Description

General part information

RGWS80TS65D Series

RGWS80TS65D is a IGBT with low collector - emitter saturation voltage, suitable for PFC, Solar converters, Mid to high switching frequency converters. The RGWS series features high-speed switching, contributing to higher efficiency of applications.

Documents

Technical documentation and resources

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

About Flammability of Materials

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Types and Features of Transistors

Application Note

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Method for Monitoring Switching Waveform

Schematic Design & Verification

RGWS80TS65D Data Sheet

Data Sheet

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Package Dimensions - TO-247GE

Package Information

Part Explanation

Application Note

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Anti-Whisker formation

Package Information

How to Use LTspice&reg; Models

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

What Is Thermal Design

Thermal Design

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Compliance of the ELV directive

Environmental Data

Moisture Sensitivity Level

Package Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

What is a Thermal Model? (IGBT)

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

About Export Administration Regulations (EAR)

Export Information

4 Steps for Successful Thermal Designing of Power Devices

White Paper