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RB541VM-40TE-17
Discrete Semiconductor Products

RB541VM-40TE-17

Active
Rohm Semiconductor

SMALL SIGNAL SCHOTTKY DIODE, SINGLE, 40 V, 200 MA, 610 MV, 1 A, 125 °C

RB541VM-40TE-17
Discrete Semiconductor Products

RB541VM-40TE-17

Active
Rohm Semiconductor

SMALL SIGNAL SCHOTTKY DIODE, SINGLE, 40 V, 200 MA, 610 MV, 1 A, 125 °C

Technical Specifications

Parameters and characteristics for this part

SpecificationRB541VM-40TE-17
Current - Average Rectified (Io)200 mA
Current - Reverse Leakage @ Vr100 µA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]125 °C
Package / CaseSC-90, SOD-323F
Speed200 mA
SpeedAny Speed
Supplier Device PackageUMD2
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]40 V
Voltage - Forward (Vf) (Max) @ If [Max]610 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2008$ 0.23

Description

General part information

RB541VM-40 Series

RB541VM-40 is Standard Schottky Barrier Diode for general rectification.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

How to Select Rectifier Diodes

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

ESD Data

Characteristics Data

How to Use LTspice&reg; Models

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Reliability Test Result

Manufacturing Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Explanation for Marking

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Inner Structure

Package Information

How to Create Symbols for PSpice Models

Models

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Compliance of the RoHS directive

Environmental Data

What Is Thermal Design

Thermal Design

About Export Regulations

Export Information

About Flammability of Materials

Environmental Data

Judgment Criteria of Thermal Evaluation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Part Explanation

Application Note

Anti-Whisker formation - Diodes

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Diode Types and Applications

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Package Dimensions

Package Information

What is a Thermal Model? (Diode)

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

Moisture Sensitivity Level - Diodes

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

List of Diode Package Thermal Resistance

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Taping Information

Package Information