Integrated Circuits (ICs)

BY25Q40GLUIG(R)

Active

BYTe Semiconductor

IC FLASH 4MBIT SPI/QUAD 8USON

Search across all available documentation for this part.

Integrated Circuits (ICs)

Active

BYTe Semiconductor

IC FLASH 4MBIT SPI/QUAD 8USON

Technical Specifications

Parameters and characteristics for this part

Specification	BY25Q40GLUIG(R)

Access Time	17 ns
Clock Frequency	50 MHz
Memory Format	FLASH
Memory Interface	SPI - Quad I/O
Memory Organization	512 K
Memory Size	512 kb
Memory Type	Non-Volatile
Mounting Type	Surface Mount
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Package / Case	8-UFDFN Exposed Pad
Supplier Device Package	8-USON (2x3)
Technology	FLASH - NOR
Voltage - Supply [Max]	2 V
Voltage - Supply [Min]	1.65 V
Write Cycle Time - Word, Page [custom]	3 ms
Write Cycle Time - Word, Page [custom]	3 ms

Part	Memory Organization	Clock Frequency	Memory Type	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Memory Interface	Package / Case	Package / Case [y]	Package / Case [x]	Memory Format	Write Cycle Time - Word, Page	Voltage - Supply [Min]	Voltage - Supply [Max]	Technology	Memory Size	Access Time	Supplier Device Package	Write Cycle Time - Word, Page [custom]	Write Cycle Time - Word, Page [custom]
BYTe Semiconductor BY25Q40GWTIG(R)	512 K	100 MHz	Non-Volatile	85 °C	-40 °C	Surface Mount	SPI - Quad I/O	8-SOIC	3.9 mm	0.154 in	FLASH	3 ms	1.65 V	3.6 V	FLASH - NOR	512 kb	17 ns	8-SOP
BYTe Semiconductor BY25Q40GWSIG(R)	512 K	100 MHz	Non-Volatile	85 °C	-40 °C	Surface Mount	SPI - Quad I/O	8-SOIC	5.3 mm	0.209 "	FLASH	3 ms	1.65 V	3.6 V	FLASH - NOR	512 kb	17 ns	8-SOP
BYTe Semiconductor BY25Q40GLUIG(R)	512 K	50 MHz	Non-Volatile	85 °C	-40 °C	Surface Mount	SPI - Quad I/O	8-UFDFN Exposed Pad			FLASH		1.65 V	2 V	FLASH - NOR	512 kb	17 ns	8-USON (2x3)	3 ms	3 ms

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

FLASH - NOR Memory IC 4Mbit SPI - Quad I/O 50 MHz 17 ns 8-USON (2x3)

Technical documentation and resources