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Discrete Semiconductor Products

RB162LAM-40TFTR

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Rohm Semiconductor

AUTOMOTIVE SCHOTTKY BARRIER DIODE (AEC-Q101 QUALIFIED)

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Discrete Semiconductor Products

RB162LAM-40TFTR

Active
Rohm Semiconductor

AUTOMOTIVE SCHOTTKY BARRIER DIODE (AEC-Q101 QUALIFIED)

Technical Specifications

Parameters and characteristics for this part

SpecificationRB162LAM-40TFTR
Current - Average Rectified (Io)1 A
Current - Reverse Leakage @ Vr100 µA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseSOD-128
QualificationAEC-Q101
Speed500 ns, 200 mA
Supplier Device PackagePMDTM
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]40 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.46
Digi-Reel® 1$ 0.46
N/A 0$ 0.60
Tape & Reel (TR) 3000$ 0.12
6000$ 0.12
9000$ 0.11
30000$ 0.10
75000$ 0.10

Description

General part information

RB162 Series

RB162LAM-40TF is a schottky barrier diode with low VF, suitable for general rectification. It is a highly reliable product for automotive.

Documents

Technical documentation and resources

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

About Flammability of Materials

Environmental Data

Anti-Whisker formation - Diodes

Package Information

Taping Information

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Part Explanation

Application Note

What is a Thermal Model? (Diode)

Thermal Design

Package Dimensions

Package Information

PCB Layout Thermal Design Guide

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

RB162LAM-40TF ESD Data

Characteristics Data

Explanation for Marking

Package Information

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

What Is Thermal Design

Thermal Design

RB162LAM-40TF Data Sheet

Data Sheet

Method for Monitoring Switching Waveform

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Diode Types and Applications

Technical Article

How to Select Rectifier Diodes

Technical Article

About Export Regulations

Export Information

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

AEC-Q101 Automotive Requirements

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