Integrated Circuits (ICs)

LPC3152FET208,551

Obsolete

IC MCU 16/32BIT ROMLESS 208TFBGA

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Integrated Circuits (ICs)

Obsolete

IC MCU 16/32BIT ROMLESS 208TFBGA

Technical Specifications

Parameters and characteristics for this part

Specification	LPC3152FET208,551

Connectivity	Memory Card, UART/USART, SPI, PCM, IrDA, I2C, EBI/EMI, USB OTG
Core Processor	ARM9®
Core Size [Max]	32 Bit
Core Size [Min]	16 Bit
Data Converters [custom]	3
Data Converters [custom]	10 b
Mounting Type	Surface Mount
Number of I/O	10
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	External
Package / Case	208-TFBGA
Program Memory Type	ROMless
RAM Size	192 K
Speed	180 MHz
Supplier Device Package	208-TFBGA (12x12)
Voltage - Supply (Vcc/Vdd) [Max]	3.6 V
Voltage - Supply (Vcc/Vdd) [Min]	1.1 V

Part	RAM Size	Operating Temperature [Max]	Operating Temperature [Min]	Number of I/O	Core Size [Min]	Core Size [Max]	Voltage - Supply (Vcc/Vdd) [Min]	Voltage - Supply (Vcc/Vdd) [Max]	Package / Case	Mounting Type	Connectivity	Speed	Program Memory Type	Oscillator Type	Core Processor	Supplier Device Package	Data Converters [custom]	Data Converters [custom]
Freescale Semiconductor - NXP LPC3152FET208,551	192 K	85 °C	-40 °C	10	16 Bit	32 Bit	1.1 V	3.6 V	208-TFBGA	Surface Mount	EBI/EMI I2C IrDA Memory Card PCM SPI UART/USART USB OTG	180 MHz	ROMless	External	ARM9®	208-TFBGA (12x12)	3	10 b

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

ARM9® LPC3100 Microcontroller IC 16/32-Bit 180MHz ROMless 208-TFBGA (12x12)

Technical documentation and resources