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Discrete Semiconductor Products

RD3N03BATTL1

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Rohm Semiconductor

PCH -80V -30A, TO-252 (DPAK), POWER MOSFET

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Discrete Semiconductor Products

RD3N03BATTL1

Active
Rohm Semiconductor

PCH -80V -30A, TO-252 (DPAK), POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRD3N03BATTL1
Current - Continuous Drain (Id) @ 25°C30 A
Drain to Source Voltage (Vdss)80 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 6 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs50 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]2200 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max)54 W
Rds On (Max) @ Id, Vgs56 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 2.24

Description

General part information

RD3N03BAT Series

RD3N03BAT is a power MOSFET with low-on resistance and high power package, suitable for Switching and Motor drives applications.

Documents

Technical documentation and resources

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Part Explanation

Application Note

TO-252_TL1 Taping Information

Package Information

Types and Features of Transistors

Application Note

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Package Dimensions

Package Information

About Export Regulations

Export Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

P-channel Power MOSFETs selection guide

Technical Article

Compliance of the RoHS directive

Environmental Data

RD3N03BAT Data Sheet

Data Sheet

RD3N03BAT ESD Data

Characteristics Data

How to Use LTspice® Models

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Report of SVHC under REACH Regulation

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Explanation for Marking

Package Information

About Flammability of Materials

Environmental Data

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

What Is Thermal Design

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification