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RS1E301GNTB1
Discrete Semiconductor Products

RS1E301GNTB1

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Rohm Semiconductor

MOSFET, N-CH, 30V, 80A, 150DEG C, 33W

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RS1E301GNTB1
Discrete Semiconductor Products

RS1E301GNTB1

Active
Rohm Semiconductor

MOSFET, N-CH, 30V, 80A, 150DEG C, 33W

Technical Specifications

Parameters and characteristics for this part

SpecificationRS1E301GNTB1
Current - Continuous Drain (Id) @ 25°C30 A, 80 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs39.8 nC
Input Capacitance (Ciss) (Max) @ Vds2500 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerTDFN
Power Dissipation (Max)3 W
Rds On (Max) @ Id, Vgs2.2 mOhm
Supplier Device Package8-HSOP
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2379$ 1.95
NewarkEach (Supplied on Cut Tape) 1$ 1.94
10$ 1.54
25$ 1.39
50$ 1.26
100$ 1.11
250$ 1.01
500$ 0.91
1000$ 0.85

Description

General part information

RS1E301GN Series

RS1E301GN is a power MOSFET with low-on resistance and High power package, suitable for switching.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

What Is Thermal Design

Thermal Design

Anti-Whisker formation - Transistors

Package Information

About Flammability of Materials

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

HSOP8(TB1) Taping Information

Package Information

How to Use LTspice® Models

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Part Explanation

Application Note

How to Create Symbols for PSpice Models

Models

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

HSOP8(TB1) Dimension

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Compliance of the RoHS directive

Environmental Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Types and Features of Transistors

Application Note

Report of SVHC under REACH Regulation

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

HSOP8(TB1) Explanation for Marking

Package Information

Inner Structure

Package Information

Taping Information

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Calculating Power Consumption:Static Operation

Thermal Design

About Export Regulations

Export Information

List of Transistor Package Thermal Resistance

Thermal Design

RS1E301GN ESD Data

Characteristics Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design