
MMIX2F60N50P3
ActiveDISC MSFT SMPD PKG-HIPERFETMSFT SMPD-B/ TUBE
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MMIX2F60N50P3
ActiveDISC MSFT SMPD PKG-HIPERFETMSFT SMPD-B/ TUBE
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Technical Specifications
Parameters and characteristics for this part
| Specification | MMIX2F60N50P3 |
|---|---|
| Configuration | 2 N-Channel (Dual) |
| Current - Continuous Drain (Id) @ 25°C | 30 A |
| Drain to Source Voltage (Vdss) | 500 V |
| Input Capacitance (Ciss) (Max) @ Vds | 6250 pF |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 150 °C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | 24-SMD Module, 9 Leads |
| Power - Max [Max] | 320 W |
| Rds On (Max) @ Id, Vgs | 110 mOhm |
| Supplier Device Package | 24-SMPD |
| Technology | MOSFET (Metal Oxide) |
| Vgs(th) (Max) @ Id | 5 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
MMIX2F60N50P3 Series
Weighing only 8g, the SMPD package is much lighter (typically by 50%) than comparable conventional power modules, thereby enabling lower weight power systems. Due to its compact and ultra-low profile package, it is possible to use the same heat sink for multiple devices, saving PCB space. An added benefit of being smaller and lighter is that it provides better protection against vibrations and g-forces, especially if used in portable appliances, increasing the life expectancy and reliability of these devices. Configurations: Buck Boost Full-bridge Half-bridge Phase leg Single
Documents
Technical documentation and resources