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US6J11TR

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Rohm Semiconductor

TRANSISTOR MOSFET ARRAY DUAL P-CH 12V 1.3A 6-PIN SOT-363T EMBOSS T/R

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Product dimension image
Discrete Semiconductor Products

US6J11TR

Active
Rohm Semiconductor

TRANSISTOR MOSFET ARRAY DUAL P-CH 12V 1.3A 6-PIN SOT-363T EMBOSS T/R

Technical Specifications

Parameters and characteristics for this part

SpecificationUS6J11TR
Configuration2 P-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C1.3 A
Drain to Source Voltage (Vdss)12 V
FET FeatureLogic Level Gate
Gate Charge (Qg) (Max) @ Vgs2.4 nC
Input Capacitance (Ciss) (Max) @ Vds290 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case6-SMD, Flat Leads
Power - Max [Max]320 mW
Supplier Device PackageTUMT6
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id1 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 4556$ 0.93
NewarkEach (Supplied on Cut Tape) 1$ 0.66
10$ 0.48
25$ 0.43
50$ 0.37
100$ 0.32
300$ 0.28
500$ 0.24
1000$ 0.22

Description

General part information

US6J11 Series

Complex type MOSFETs(P+P) are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Documents

Technical documentation and resources

Anti-Whisker formation - Transistors

Package Information

How to Create Symbols for PSpice Models

Models

Method for Monitoring Switching Waveform

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

About Export Regulations

Export Information

List of Transistor Package Thermal Resistance

Thermal Design

Taping Information

Package Information

Compliance of the RoHS directive

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Part Explanation

Application Note

What Is Thermal Design

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

US6J11 Data Sheet

Data Sheet

P-channel Power MOSFETs selection guide

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Types and Features of Transistors

Application Note

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Reliability Test Result

Manufacturing Data

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Explanation for Marking

Package Information

Inner Structure

Package Information

Package Dimensions

Package Information

ESD Data

Characteristics Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification