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Connectors, Interconnects
L17HTHCP4F4C
ActiveAmphenol ICC (Commercial Products)
CONN D-SUB HD PLUG 62P R/A SLDR
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Connectors, Interconnects
L17HTHCP4F4C
ActiveAmphenol ICC (Commercial Products)
CONN D-SUB HD PLUG 62P R/A SLDR
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | L17HTHCP4F4C |
|---|---|
| Backset Spacing | 8.89 mm |
| Backset Spacing | 0.35 in |
| Connector Style | High Density, D-Sub |
| Connector Type | Plug, Male Pins |
| Contact Finish | Gold |
| Contact Finish Thickness | 0.76 Ám |
| Contact Finish Thickness | 30 Áin |
| Contact Form | Stamped |
| Contact Material | Copper Alloy |
| Contact Type | Signal |
| Current Rating (Amps) | 3 A |
| Dielectric Material | Thermoplastic, Glass Filled |
| Features | Grounding Indents, Board Lock |
| Flange Feature | Female Screwlock (4-40), Mating Side |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole, Right Angle |
| Number of Positions | 62 |
| Number of Rows | 3 |
| Operating Temperature [Max] | 150 °C |
| Operating Temperature [Min] | -55 °C |
| Shell Size, Connector Layout | 4 |
| Termination | Solder |
| Voltage Rating | 300 VDC |
| Part | Material Flammability Rating | Mounting Type | Connector Type | Current Rating (Amps) | Contact Type | Contact Finish | Contact Material | Termination | Connector Style | Shell Size, Connector Layout | Features | Number of Positions | Contact Form | Dielectric Material | Flange Feature | Operating Temperature [Min] | Operating Temperature [Max] | Voltage Rating | Number of Rows | Contact Finish Thickness | Contact Finish Thickness | Backset Spacing | Backset Spacing | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (Commercial Products) | UL94 V-0 | Through Hole Right Angle | Male Pins Plug | 3 A | Signal | Gold | Copper Alloy | Solder | D-Sub High Density | 4 | Board Lock Grounding Indents | 62 | Stamped | Thermoplastic Glass Filled | 4-40 Board Side | -55 °C | 150 °C | 300 VDC | 3 | 15 µin | 0.38 µm | 8.89 mm | 0.35 in | |
Amphenol ICC (Commercial Products) | UL94 V-0 | Through Hole Right Angle | Male Pins Plug | 3 A | Signal | Gold | Copper Alloy | Solder | D-Sub High Density | 4 | Board Lock Grounding Indents | 62 | Stamped | Thermoplastic Glass Filled | Female Screwlock (4-40) Mating Side | -55 °C | 150 °C | 300 VDC | 3 | 15 µin | 0.38 µm | 8.89 mm | 0.35 in | |
Amphenol ICC (Commercial Products) | UL94 V-0 | Through Hole Right Angle | Male Pins Plug | 3 A | Signal | Gold | Copper Alloy | Solder | D-Sub High Density | 4 | Board Lock Grounding Indents | 62 | Stamped | Thermoplastic Glass Filled | Female Screwlock (4-40) Mating Side | -55 °C | 150 °C | 300 VDC | 3 | 8.89 mm | 0.35 in | Flash | ||
Amphenol ICC (Commercial Products) | UL94 V-0 | Through Hole Right Angle | Male Pins Plug | 3 A | Signal | Gold | Copper Alloy | Solder | D-Sub High Density | 4 | Board Lock Grounding Indents | 62 | Stamped | Thermoplastic Glass Filled | 4-40 Board Side | -55 °C | 150 °C | 300 VDC | 3 | 30 Áin | 0.76 Ám | 8.89 mm | 0.35 in | |
Amphenol ICC (Commercial Products) | UL94 V-0 | Through Hole Right Angle | Male Pins Plug | 3 A | Signal | Gold | Copper Alloy | Solder | D-Sub High Density | 4 | Board Lock Grounding Indents | 62 | Stamped | Thermoplastic Glass Filled | Female Screwlock (4-40) Mating Side | -55 °C | 150 °C | 300 VDC | 3 | 30 Áin | 0.76 Ám | 8.89 mm | 0.35 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tray | 1000 | $ 6.46 | |
Description
General part information
L17HTHCP4 Series
62 Position D-Sub, High Density Plug, Male Pins Connector
Documents
Technical documentation and resources