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R8006KND3TL1
Discrete Semiconductor Products

R8006KND3TL1

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING, NCH 800V 6A, TO-252 (DPAK), POWER MOSFET

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R8006KND3TL1
Discrete Semiconductor Products

R8006KND3TL1

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING, NCH 800V 6A, TO-252 (DPAK), POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationR8006KND3TL1
Current - Continuous Drain (Id) @ 25°C6 A
Drain to Source Voltage (Vdss)800 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]22 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]650 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max)83 W
Rds On (Max) @ Id, Vgs900 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 818$ 4.43

Description

General part information

R8006KND3 Series

The R8xxxKNx series are high-speed switching products, Super Junction MOSFETs, that place an emphasis on high efficiency. This series products achieve higher efficiency via high-speed switching. High-speed switching makes it possible to contribute to higher efficiency in PFC and LLC circuits.

Documents

Technical documentation and resources

List of Transistor Package Thermal Resistance

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Explanation for Marking

Package Information

Report of SVHC under REACH Regulation

Environmental Data

R8006KND3 Data Sheet

Data Sheet

About Flammability of Materials

Environmental Data

About Export Regulations

Export Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Reliability Test Result

Manufacturing Data

How to Use LTspice® Models

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Compliance of the RoHS directive

Environmental Data

R8006KND3 ESD Data

Characteristics Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

PCB Layout Thermal Design Guide

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Types and Features of Transistors

Application Note

Method for Monitoring Switching Waveform

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

What Is Thermal Design

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Part Explanation

Application Note

TO-252_TL1 Taping Information

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Package Dimensions

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article