Integrated Circuits (ICs)

XEF216-512-FB236-I20

Obsolete

IC MCU 32BIT 2MB FLASH 236FBGA

Integrated Circuits (ICs)

Obsolete

IC MCU 32BIT 2MB FLASH 236FBGA

Technical Specifications

Parameters and characteristics for this part

Specification	XEF216-512-FB236-I20

Connectivity	USB, RGMII
Core Count	16 Core
Core Processor	XCore
Core Size (Bit Width)	32 Bit
Mounting Type	Surface Mount
Number of I/O	73
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	External
Package / Case	236-LFBGA
Package Length	10 mm
Package Name	236-FBGA
Package Width	10 mm
Program Memory Depth	2 M
Program Memory Size	2 MB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	512 K
RAM Size Width	8 bit
Speed	2000 MIPS
Voltage - Supply (Vcc/Vdd) Maximum	3.6 V
Voltage - Supply (Vcc/Vdd) Minimum	0.95 V

Part	Voltage - Supply (Vcc/Vdd) Minimum	Voltage - Supply (Vcc/Vdd) Maximum	Program Memory Width	Program Memory Size	Program Memory Depth	Number of I/O	Core Processor	Core Count	Core Size (Bit Width)	Oscillator Type	Package / Case	Package Width	Package Name	Package Length	Program Memory Type	Mounting Type	Connectivity	Operating Temperature (Max)	Operating Temperature (Min)	RAM Size Width	RAM Size Depth	Speed
XMOS XEF216-512-FB236-I20	0.95 V	3.6 V	8 bit	2 MB	2 M	73	XCore	16 Core	32 Bit	External	236-LFBGA	10 mm	236-FBGA	10 mm	FLASH	Surface Mount	RGMII USB	85 °C	-40 °C	8 bit	512 K	2000 MIPS
XMOS XEF216-512-FB236-I20A	0.95 V	3.6 V	8 bit	2 MB	2 M	73	XCore	16 Core	32 Bit	External	236-LFBGA	10 mm	236-FBGA	10 mm	FLASH	Surface Mount	RGMII USB	85 °C	-40 °C	8 bit	512 K	2000 MIPS

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

3D models and CAD resources for this part

General part information

XCore XEF Microcontroller IC 32-Bit 16-Core 2000MIPS 2MB (2M x 8) FLASH 236-FBGA (10x10)

Technical documentation and resources