Integrated Circuits (ICs)

R7F701373AEABG-C#BC1

Active

IC MCU 32BIT

Search across all available documentation for this part.

Integrated Circuits (ICs)

Active

IC MCU 32BIT

Technical Specifications

Parameters and characteristics for this part

Specification	R7F701373AEABG-C#BC1

Connectivity	SPI, FIFO, CSI, Ethernet, SENT, UART/USART, LINbus, CANbus, FlexRay
Core Processor	RH850G3M
Core Size [custom]	32-Bit Dual-Core
Data Converters [custom]	12
Data Converters [custom]	24
EEPROM Size	64 K
Grade	Automotive
Mounting Type	Surface Mount
Oscillator Type	Internal
Package / Case	292-FBGA
Peripherals	DMA, PWM, POR, Temp Sensor, WDT
Program Memory Size	2 MB
Program Memory Type	FLASH
Qualification	AEC-Q100
RAM Size	448 K
Speed	240 MHz
Supplier Device Package	292-FBGA (17x17)

Part	Program Memory Type	Supplier Device Package	Data Converters [custom]	Data Converters [custom]	Peripherals	EEPROM Size	Speed	Oscillator Type	Core Size [custom]	Package / Case	Connectivity	Program Memory Size	Core Processor	RAM Size	Mounting Type	Qualification	Grade
Renesas Electronics Corporation R7F701373AEABG-C#BC1	FLASH	292-FBGA (17x17)	12	24	DMA POR PWM Temp Sensor WDT	64 K	240 MHz	Internal	32-Bit Dual-Core	292-FBGA	CANbus CSI Ethernet FIFO FlexRay LINbus SENT SPI UART/USART	2 MB	RH850G3M	448 K	Surface Mount	AEC-Q100	Automotive

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

RH850G3M RH850/P1M-C Microcontroller IC 32-Bit Dual-Core 240MHz 2MB (2M x 8) FLASH 292-FBGA (17x17)

Technical documentation and resources

No documents available