Integrated Circuits (ICs)

R7F701373AEABG-C#BC1

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IC MCU 32BIT

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Integrated Circuits (ICs)

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IC MCU 32BIT

Technical Specifications

Parameters and characteristics for this part

Specification	R7F701373AEABG-C#BC1

Connectivity	SPI, FlexRay, FIFO, CSI, CANbus, Ethernet, UART/USART, SENT, LINbus
Core Processor	RH850G3M
Core Size	32 Bit
Core Size	Dual-Core
Data Converters	A/D 24x12b SAR
EEPROM Size	64 K
Grade	Automotive
Mounting Type	Surface Mount
Operating Temperature [Max]	150 °C
Operating Temperature [Min]	-40 C
Oscillator Type	Internal
Package / Case	292-FBGA
Peripherals	DMA, POR, PWM, WDT, Temp Sensor
Program Memory Size	2 MB
Program Memory Type	FLASH
Qualification	AEC-Q100
RAM Size	448 K
Speed	240 MHz
Supplier Device Package	292-FBGA
Supplier Device Package [x]	17
Supplier Device Package [y]	17

Part	EEPROM Size	Data Converters	Grade	Program Memory Size	Core Size	Core Size	Package / Case	Connectivity	RAM Size	Peripherals	Program Memory Type	Operating Temperature [Min]	Operating Temperature [Max]	Supplier Device Package [y]	Supplier Device Package	Supplier Device Package [x]	Speed	Oscillator Type	Core Processor	Mounting Type	Qualification
Renesas Electronics Corporation R7F701373AEABG-C#BC1	64 K	A/D 24x12b SAR	Automotive	2 MB	32 Bit	Dual-Core	292-FBGA	CANbus CSI Ethernet FIFO FlexRay LINbus SENT SPI UART/USART	448 K	DMA POR PWM Temp Sensor WDT	FLASH	-40 C	150 °C	17	292-FBGA	17	240 MHz	Internal	RH850G3M	Surface Mount	AEC-Q100

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

RH850G3M RH850/P1M-C Microcontroller IC 32-Bit Dual-Core 240MHz 2MB (2M x 8) FLASH 292-FBGA (17x17)

Technical documentation and resources