
Deep-Dive with AI
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Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | TNETV2665FIBZDUA6 |
|---|---|
| Clock Rate | 600 MHz |
| Interface | I2C, HPI, EBI/EMI, McASP, McBSP, UART, 10/100 Ethernet MAC |
| Mounting Type | Surface Mount |
| Non-Volatile Memory | 64 kB |
| Non-Volatile Memory | ROM |
| On-Chip RAM | 240 kB |
| Operating Temperature [Max] | 125 ¯C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 376-BBGA Exposed Pad |
| Supplier Device Package | 376-BGA (23x23) |
| Type | Fixed Point |
| Voltage - Core | 1.05 V, 1.2 V |
| Voltage - I/O | 3.3 V, 1.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tray | 60 | $ 44.24 | |
Description
General part information
TNETV2665 Series
TNETV2665FIBZDUA6
Documents
Technical documentation and resources
No documents available