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Discrete Semiconductor Products

RF4E075ATTCR

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Rohm Semiconductor

PCH -30V -7.5A MIDDLE POWER MOSFET

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Product dimension image
Discrete Semiconductor Products

RF4E075ATTCR

Active
Rohm Semiconductor

PCH -30V -7.5A MIDDLE POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRF4E075ATTCR
Current - Continuous Drain (Id) @ 25°C7.5 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]22 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]1000 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerUDFN
Power Dissipation (Max)2 W
Rds On (Max) @ Id, Vgs21.7 mOhm
Supplier Device PackageHUML2020L8
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 10396$ 1.02

Description

General part information

RF4E075AT Series

RF4E075AT which is High Power small mold package is suitable for Switching, Load switch.

Documents

Technical documentation and resources

What is a Thermal Model? (Transistor)

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

About Export Regulations

Export Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Package Dimensions

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Compliance of the RoHS directive

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Taping Information

Package Information

Anti-Whisker formation - Transistors

Package Information

Types and Features of Transistors

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

P-channel Power MOSFETs selection guide

Technical Article

About Flammability of Materials

Environmental Data

Explanation for Marking

Package Information

Part Explanation

Application Note

Condition of Soldering / Land Pattern Reference

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

ESD Data

Characteristics Data

RF4E075AT Data Sheet

Data Sheet

Two-Resistor Model for Thermal Simulation

Thermal Design

What Is Thermal Design

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

How to Create Symbols for PSpice Models

Models

Inner Structure

Package Information

Moisture Sensitivity Level - Transistors

Package Information

Constitution Materials List

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design