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Discrete Semiconductor Products

BSS4130AT116

Active
Rohm Semiconductor

BIPOLAR TRANSISTORS - BJT BSS4130A IS A SOT-23 PACKAGE TRANSISTOR FOR LOW FREQUENCY AMPLIFIER, DRIVER.

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Product thumbnail image
Discrete Semiconductor Products

BSS4130AT116

Active
Rohm Semiconductor

BIPOLAR TRANSISTORS - BJT BSS4130A IS A SOT-23 PACKAGE TRANSISTOR FOR LOW FREQUENCY AMPLIFIER, DRIVER.

Technical Specifications

Parameters and characteristics for this part

SpecificationBSS4130AT116
Current - Collector (Ic) (Max) [Max]1 A
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]270
Frequency - Transition400 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-23-3, TO-236-3, SC-59
Power - Max [Max]200 mW
Supplier Device PackageSST3
Transistor TypeNPN
Vce Saturation (Max) @ Ib, Ic350 mV
Voltage - Collector Emitter Breakdown (Max) [Max]30 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.58
10$ 0.36
100$ 0.23
500$ 0.17
1000$ 0.15
Digi-Reel® 1$ 0.58
10$ 0.36
100$ 0.23
500$ 0.17
1000$ 0.15
N/A 0$ 0.58
Tape & Reel (TR) 3000$ 0.09
MouserN/A 1$ 0.50
10$ 0.35
100$ 0.23
500$ 0.17
1000$ 0.16
3000$ 0.13
6000$ 0.12
9000$ 0.10
24000$ 0.10

Description

General part information

BSS4130A Series

BSS4130A is a SOT-23 package Transistor for low frequency amplifier, driver.

Documents

Technical documentation and resources

How to Create Symbols for PSpice Models

Models

Reliability Test Result

Manufacturing Data

Moisture Sensitivity Level - Transistors

Package Information

About Flammability of Materials

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

What Is Thermal Design

Thermal Design

About Export Regulations

Export Information

List of Transistor Package Thermal Resistance

Thermal Design

Compliance of the RoHS directive

Environmental Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

Taping Information

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Explanation for Marking

Package Information

Anti-Whisker formation - Transistors

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Part Explanation

Application Note

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Package Dimensions

Package Information

How to Use LTspice® Models

Schematic Design & Verification

BSS4130A Data Sheet

Data Sheet

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Types and Features of Transistors

Application Note

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data