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Discrete Semiconductor Products

YQ12RSM10SDTL1

Active
Rohm Semiconductor

TRENCH MOS STRUCTURE, 100V, 12A, TO-277GE, HIGHLY EFFICIENT SBD

Product dimension image
Discrete Semiconductor Products

YQ12RSM10SDTL1

Active
Rohm Semiconductor

TRENCH MOS STRUCTURE, 100V, 12A, TO-277GE, HIGHLY EFFICIENT SBD

Technical Specifications

Parameters and characteristics for this part

SpecificationYQ12RSM10SDTL1
Current - Average Rectified (Io)12 A
Current - Reverse Leakage @ Vr90 µA
Mounting TypeSurface Mount
Operating Temperature - Junction175 °C
Package / CaseTO-277, 3-PowerDFN
Speed500 ns, 200 mA
Supplier Device PackageTO-277A
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]100 V
Voltage - Forward (Vf) (Max) @ If670 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 3916$ 1.71
NewarkEach (Supplied on Cut Tape) 1$ 1.78
10$ 1.26
25$ 1.14
50$ 1.02
100$ 0.89
250$ 0.78
500$ 0.70
1000$ 0.63

Description

General part information

YQ12RSM10SD Series

The YQ12RSM10SD is a highly efficient Schottky Barrier Diode that is designed improving the tradeoff between low VFand low IR. While its low VFit achieves stable operation at high temperatures. Ideal for switching power supplies, freewheel diodes, and reverse polarity protection applications.

Documents

Technical documentation and resources

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

Diode Types and Applications

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

What Is Thermal Design

Thermal Design

About Export Regulations

Export Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Anti-Whisker formation - Diodes

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Compliance of the RoHS directive

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

YQ12RSM10SD Data Sheet

Data Sheet

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Part Explanation

Application Note

What is a Thermal Model? (Diode)

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Select Rectifier Diodes

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

TO-277GE Dimensions

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

Moisture Sensitivity Level - Diodes

Package Information