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Discrete Semiconductor Products

AG085FGD3HRBTL

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Rohm Semiconductor

MOSFETS NCH 40V 80A, TO-252 (DPAK), POWER MOSFET FOR AUTOMOTIVE

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Search across all available documentation for this part.

DocumentsMethod for Monitoring Switching Waveform Basics of Thermal Resistance and Heat Dissipation +40

Product dimension image

Discrete Semiconductor Products

AG085FGD3HRBTL

Active

Rohm Semiconductor

MOSFETS NCH 40V 80A, TO-252 (DPAK), POWER MOSFET FOR AUTOMOTIVE

Deep-Dive with AI

DocumentsMethod for Monitoring Switching Waveform Basics of Thermal Resistance and Heat Dissipation +40

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	AG085FGD3HRBTL

Drain to Source Voltage (Vdss)	40 V
Drive Voltage (Max Rds On, Min Rds On)	10 V, 4.5 V
FET Type	N-Channel
Gate Charge (Qg) (Max) @ Vgs	41 nC
Grade	Automotive
Input Capacitance (Ciss) (Max) @ Vds [Max]	2570 pF
Mounting Type	Surface Mount
Operating Temperature	175 °C
Package / Case	TO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max)	96 W
Qualification	AEC-Q101
Rds On (Max) @ Id, Vgs	3.1 mOhm
Supplier Device Package	TO-252
Technology	MOSFET (Metal Oxide)
Vgs (Max)	20 V
Vgs(th) (Max) @ Id	2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	2500	$ 2.70
Mouser	N/A	1	$ 2.18
		10	$ 1.53
		100	$ 1.16
		250	$ 1.00
		500	$ 0.97
		1000	$ 0.86
		2500	$ 0.84
		5000	$ 0.82
		10000	$ 0.80
Newark	Each (Supplied on Cut Tape)	1	$ 2.27
		10	$ 1.59
		25	$ 1.47
		50	$ 1.33
		100	$ 1.21
		250	$ 1.04
		500	$ 1.01
		1000	$ 0.90

Description

General part information

AG085FGD3HRB Series

AG085FGD3HRB is an automotive grade MOSFET that is AEC-Q101 qualified. Ideal for Automotive Systems

Documents

Technical documentation and resources

Method for Monitoring Switching Waveform

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Anti-Whisker formation - Transistors

Package Information

About Export Regulations

Export Information

AG085FGD3HRB ESD Data

Characteristics Data

θ<sub>JC</sub> and Ψ<sub>JT</sub>

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Types and Features of Transistors

Application Note

PCB Layout Thermal Design Guide

Condition of Soldering / Land Pattern Reference

Package Information

Part Explanation

Application Note

Report of SVHC under REACH Regulation

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

What is a Thermal Model? (Transistor)

About Flammability of Materials

Environmental Data

Report of SVHC under REACH Regulation

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Measurement Method and Usage of Thermal Resistance RthJC

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Notes for Calculating Power Consumption:Static Operation

How to Use LTspice® Models

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

What Is Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Two-Resistor Model for Thermal Simulation

Explanation for Marking

Package Information

Package Dimensions

Package Information

TO-252_TL Taping Information

Package Information

AG085FGD3HRB Data Sheet

Judgment Criteria of Thermal Evaluation

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Notes for Temperature Measurement Using Thermocouples

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

AG085FGD3HRB Series

Nch 40V 80A, TO-252 (DPAK), Power MOSFET for Automotive

Part	Operating Temperature	FET Type	Package / Case	Technology	Vgs(th) (Max) @ Id	Drain to Source Voltage (Vdss)	Input Capacitance (Ciss) (Max) @ Vds [Max]	Qualification	Gate Charge (Qg) (Max) @ Vgs	Grade	Drive Voltage (Max Rds On, Min Rds On)	Vgs (Max)	Rds On (Max) @ Id, Vgs	Power Dissipation (Max)	Supplier Device Package	Mounting Type
Rohm Semiconductor AG085FGD3HRBTL	175 °C	N-Channel	DPAK (2 Leads + Tab) SC-63 TO-252-3	MOSFET (Metal Oxide)	2.5 V	40 V	2570 pF	AEC-Q101	41 nC	Automotive	4.5 V 10 V	20 V	3.1 mOhm	96 W	TO-252	Surface Mount