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ONSEMI NSVP264SDSF3T1G
Discrete Semiconductor Products

DA221FHTL

Active
Rohm Semiconductor

LOW-LEAKAGE, 20V, 100MA, SERIES CONNECTION, SWITCHING DIODE FOR AUTOMOTIVE

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ONSEMI NSVP264SDSF3T1G
Discrete Semiconductor Products

DA221FHTL

Active
Rohm Semiconductor

LOW-LEAKAGE, 20V, 100MA, SERIES CONNECTION, SWITCHING DIODE FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationDA221FHTL
Current - Average Rectified (Io) (per Diode)100 mA
Current - Reverse Leakage @ Vr100 nA
Diode Configuration1 Pair Series Connection
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseSOT-416, SC-75
QualificationAEC-Q101
Speed200 mA
SpeedAny Speed
Supplier Device PackageEMD3
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]20 V
Voltage - Forward (Vf) (Max) @ If1 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.52
10$ 0.32
100$ 0.20
500$ 0.15
1000$ 0.14
Digi-Reel® 1$ 0.52
10$ 0.32
100$ 0.20
500$ 0.15
1000$ 0.14
N/A 5330$ 0.43
Tape & Reel (TR) 3000$ 0.11
6000$ 0.10
9000$ 0.10
15000$ 0.09
21000$ 0.09
30000$ 0.09
75000$ 0.08
NewarkEach (Supplied on Cut Tape) 1$ 0.49
10$ 0.32
25$ 0.28
50$ 0.24
100$ 0.20
250$ 0.18
500$ 0.16
1000$ 0.13

Description

General part information

DA221 Series

ROHM's switching diodes, including diode arrays, are available in high-reliability packages and stable supply for various applications.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Reliability Test Result

Manufacturing Data

Package Dimensions

Package Information

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Flammability of Materials

Environmental Data

Taping Information

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Diode Types and Applications

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Anti-Whisker formation - Diodes

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Compliance of the RoHS directive

Environmental Data

Explanation for Marking

Package Information

Inner Structure

Package Information

What is a Thermal Model? (Diode)

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Part Explanation

Application Note

What Is Thermal Design

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

About Export Regulations

Export Information

How to Use LTspice® Models

Schematic Design & Verification

ESD Data

Characteristics Data

List of Diode Package Thermal Resistance

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Moisture Sensitivity Level - Diodes

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models