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ROHM RB088LAM150TFTR
Discrete Semiconductor Products

RSX501LAM20TR

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Rohm Semiconductor

SCHOTTKY DIODES & RECTIFIERS 20V VR 5A IR SCHOTTKY BR DIODE

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ROHM RB088LAM150TFTR
Discrete Semiconductor Products

RSX501LAM20TR

Active
Rohm Semiconductor

SCHOTTKY DIODES & RECTIFIERS 20V VR 5A IR SCHOTTKY BR DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationRSX501LAM20TR
Current - Average Rectified (Io)5 A
Current - Reverse Leakage @ Vr500 µA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseSOD-128
Speed500 ns, 200 mA
Supplier Device PackagePMDTM
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]20 V
Voltage - Forward (Vf) (Max) @ If [Max]390 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 3651$ 0.64
MouserN/A 1$ 0.46
10$ 0.28
100$ 0.23
250$ 0.22
500$ 0.19
1000$ 0.16
3000$ 0.12
6000$ 0.11
9000$ 0.11
NewarkEach (Supplied on Cut Tape) 1$ 0.48
10$ 0.33
25$ 0.29
50$ 0.25
100$ 0.23
250$ 0.21
500$ 0.20
1000$ 0.19

Description

General part information

RSX501LAM20 Series

RSX501LAM20 is a schottky barrier diode with low VFand Low IR, suitable for general rectification.

Documents

Technical documentation and resources

Product Change Notice EN

Datasheet

Technical Data Sheet EN

Datasheet

RSX501LAM20 ESD Data

Characteristics Data

How to Use LTspice® Models

Schematic Design & Verification

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Inner Structure

Package Information

Moisture Sensitivity Level - Diodes

Package Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Anti-Whisker formation - Diodes

Package Information

Power Loss and Thermal Design of Diodes

Thermal Design

RSX501LAM20 Data Sheet

Data Sheet

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Compliance of the RoHS directive

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

How to Select Rectifier Diodes

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Taping Information

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Reliability Test Result

Manufacturing Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

What Is Thermal Design

Thermal Design

How to Create Symbols for PSpice Models

Models

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

About Export Regulations

Export Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Package Dimensions

Package Information

Diode Types and Applications

Technical Article

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

Explanation for Marking

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Report of SVHC under REACH Regulation

Environmental Data

What is a Thermal Model? (Diode)

Thermal Design

Part Explanation

Application Note