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Discrete Semiconductor Products

RS6G120BGTB1

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Rohm Semiconductor

NCH 40V 210A, HSOP8, POWER MOSFET

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Product dimension image
Discrete Semiconductor Products

RS6G120BGTB1

Active
Rohm Semiconductor

NCH 40V 210A, HSOP8, POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRS6G120BGTB1
Current - Continuous Drain (Id) @ 25°C120 A
Drain to Source Voltage (Vdss)40 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Input Capacitance (Ciss) (Max) @ Vds4240 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerTDFN
Power Dissipation (Max)104 W
Rds On (Max) @ Id, Vgs [Max]1.34 mOhm
Supplier Device Package8-HSOP
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2081$ 4.35

Description

General part information

RS6G120BG Series

RS6G120BG is a power MOSFET with low-on resistance and High power package, suitable for switching.

Documents

Technical documentation and resources

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Types and Features of Transistors

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

HSOP8 Cu CRIP Inner Structure

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Part Explanation

Application Note

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

HSOP8(TB1) Taping Information

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

About Flammability of Materials

Environmental Data

HSOP8(TB1) Explanation for Marking

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

HSOP8(TB1) Dimension

Package Information

About Export Regulations

Export Information

RS6G120BG Data Sheet

Data Sheet

How to Use LTspice® Models

Schematic Design & Verification

RS6G120BG ESD Data

Characteristics Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Taping Information

Package Information