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Discrete Semiconductor Products

RGTVX2TS65GC13

NRND
Rohm Semiconductor

2ΜS SHORT-CIRCUIT TOLERANCE, 650V 60A, TO-247N, FIELD STOP TRENCH IGBT

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Product thumbnail image
Discrete Semiconductor Products

RGTVX2TS65GC13

NRND
Rohm Semiconductor

2ΜS SHORT-CIRCUIT TOLERANCE, 650V 60A, TO-247N, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGTVX2TS65GC13
Current - Collector (Ic) (Max) [Max]111 A
Current - Collector Pulsed (Icm)240 A
Gate Charge123 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 °C
Package / CaseTO-247-3
Power - Max [Max]319 W
Supplier Device PackageTO-247GE
Switching Energy2.08 mJ, 1.15 mJ
Td (on/off) @ 25°C49 ns, 150 ns
Test Condition10 Ohm, 15 V, 400 V, 60 A
Vce(on) (Max) @ Vge, Ic1.9 V
Voltage - Collector Emitter Breakdown (Max) [Max]650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 600$ 7.27
NewarkEach 1$ 6.73
10$ 5.66
25$ 5.29
50$ 4.94
100$ 4.58

Description

General part information

RGTVX2TS65 Series

The RGTVX2TS65 is a 2μs SCSOA guaranteed IGBT, suitable for PFC, solar inverter, UPS, welding and IH. The RGTV/RGW series is a highly efficient series that is optimized the trade-off relationship between conduction loss and switching speed. In addition, optimizing the internal design allowed to achieve smooth switching characteristics that decrease voltage overshoot. It contributes to reduce the number of parts required along with design load.

Documents

Technical documentation and resources

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Two-Resistor Model for Thermal Simulation

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

What Is Thermal Design

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Export Administration Regulations (EAR)

Export Information

About Flammability of Materials

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Compliance of the ELV directive

Environmental Data

Types and Features of Transistors

Application Note

What is a Thermal Model? (IGBT)

Thermal Design

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

RGTVX2TS65 Data Sheet

Data Sheet

Package Dimensions - TO-247GE

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Moisture Sensitivity Level

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Anti-Whisker formation

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Part Explanation

Application Note

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design