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RB088NS150TL
Discrete Semiconductor Products

RB088NS150TL

Active
Rohm Semiconductor

SUPER LOW IR, 150V, 10A, TO-263S (D2PAK), SCHOTTKY BARRIER DIODE

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RB088NS150TL
Discrete Semiconductor Products

RB088NS150TL

Active
Rohm Semiconductor

SUPER LOW IR, 150V, 10A, TO-263S (D2PAK), SCHOTTKY BARRIER DIODE

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationRB088NS150TL
Current - Average Rectified (Io) (per Diode)10 A
Current - Reverse Leakage @ Vr15 µA
Diode Configuration1 Pair Common Cathode
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263-3, TO-263AB
Speed500 ns, 200 mA
Supplier Device PackageLPDS
TechnologySchottky
Voltage - Forward (Vf) (Max) @ If880 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 886$ 2.36
NewarkEach (Supplied on Cut Tape) 1$ 1.03

Description

General part information

RB088NS150 Series

ROHM's schottky barrier diodes are low VF, low IR and high ESD resistant, suitable for phone and various portable electronics.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Part Explanation

Application Note

Inner Structure

Package Information

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

How to Use LTspice® Models

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

List of Diode Package Thermal Resistance

Thermal Design

Anti-Whisker formation - Diodes

Package Information

How to Select Rectifier Diodes

Technical Article

ESD Data

Characteristics Data

PCB Layout Thermal Design Guide

Thermal Design

What Is Thermal Design

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Constitution Materials List

Environmental Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Create Symbols for PSpice Models

Models

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Diode Types and Applications

Technical Article

Reliability Test Result

Manufacturing Data

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

About Export Regulations

Export Information

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Compliance of the RoHS directive

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification